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SI7454DDP

Vishay

N-Channel 100-V (D-S) MOSFET


SI7454DDP
SI7454DDP

PDF File SI7454DDP PDF File


Description
New Product N-Channel 100 V (D-S) MOSFET Si7454DDP Vishay Siliconix PRODUCT SUMMARY VDS (V) 100 RDS(on) () Max.
0.
033 at VGS = 10 V 0.
036 at VGS = 7.
5 V 0.
047 at VGS = 4.
5 V ID (A)a 21 20 17.
7 PowerPAK® SO-8 Qg (Typ.
) 6.
1 nC 6.
15 mm S 1S 5.
15 mm 2 S 3G 4 D 8D 7 D 6 D 5 Bottom View Ordering Information: Si7454DDP-T1-GE3 (Lead (Pb)-free and Halogen-free) FEATURES • TrenchFET® Power MOSFET • 100 % Rg and UIS Tested • Material categorization: For definitions of compliance please see www.
vishay.
com/doc?99912 APPLICATIONS • DC/DC Primary Side Switch • Telecom/Server 48 V, Full/Half-Bridge DC/DC • Industrial • Synchronous Rectification D G S N-Channel MOSFET ABSOLUTE MAXIMUM RATINGS (TA = 25 °C, unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C ID TA = 70 °C Pulsed Drain Current (t = 300 µs) IDM Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IS Single Pulse Avalanche Current Single Pulse Avalanche Energy L =0.
1 mH IAS EAS TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C PD TA = 70 °C Operating Junction and Storage Temperature Range TJ, Tstg Soldering Recommendations (Peak Temperature)d, e Limit 100 ± 20 21 17 7.
9b, c 6.
3b, c 40 22 3.
7b, c 12 7.
2 29.
7 19 4.
1b, c 2.
6b, c - 55 to 150 260 Unit V A mJ W °C THERMAL RESISTANCE RATINGS Parameter Symbol Typical Maximum Unit Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t  10 s Steady State RthJA RthJC 24 3.
3 30 °C/W 4.
2 Notes: a.
Based on TC = 25 °C.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 10 s.
d.
See solder profile (www.
vishay.
com/doc?73257).
The PowerPAK SO-8 is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom si...



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