MACHINED BOARD STACKING STRIPS
Description
BBS–116–G–C
F-210-1
BDL–120–T–F
BBL
(3.
89mm) .
153" SL
(2,54mm) .
100" BBS, BBL, BHS, BBD, BDL SERIES
BBS–120–T–B BBS–108–T–A
MACHINED BOARD STACKING STRIPS
Mates with: SS, SD, HSS, SL, SDL, ESS, ESD
TYPE STRIP
1
NO.
PINS PER ROW
PLATING OPTION
LEAD STYLE
FEATURES
• Low profile design achieves (3,89mm) .
153" board spacings when mated with SL series.
• Choice of precision machined (BXX Series) or coined (LBS Series) terminals.
• Approach the reliability of a permanent connection with the flexibility of a separable connection.
BBS
= Standard Single Row
(2,54) .
100 x No.
of Positions (2,54) .
100 (2,54) .
100 TYP (1,27) .
050
–G
=20µ" (0,51µm) Gold
BBL
= Low Profile Single Row
(2,54) .
100
–T
=Tin
BBL body available with Styles –E & –F only.
BHS
= High Temp Single Row
BBS BHS
BBL
(2,54) .
100 x No.
of Positions
SPECIFICATIONS
For complete specifications see www.
samtec.
com?BBS, www.
samtec.
com?BBD, www.
samtec.
com?BBL or www.
samtec.
com?BDL
BBD
= Standard Double Row
(5,08) .
200 (2,54) .
100 TYP
(2,54) .
100 (1,27) .
050
01 thru 32
= BBS & BBL
BDL
= Low Profile Double Row
(2,54) .
100
01 thru 36
= BBD, BDL & BHS
BDL body available with Styles –E & –F only.
BBS, BBD, BBL, BDL
Insulator Material: Black Glass Filled Polyester (BBS, BBD, BBL) Black High Temp Nylon (BDL) Temperature Range: -55°C to +125°C Terminal Material: Phosphor Bronze or Brass Plating: Au or Sn over 50µ" (1,27µm) Ni Current Rating: 1A RoHS Compliant: Yes Lead-Free Solderable: Wave only
BBD
BDL
–A
Z = (5,33) .
210
–B
Z = (8,51) .
335
–C
Z = (14,86) .
585
–E
Z = (1,78) .
070
–F
Z = (2,16) .
085
Style E: (2,74) .
108
Style F: (3,18) .
125 (0,46) .
018 DIA
(3,18) .
125
(0,46) .
018 DIA (1,27) .
050
SPECIFICATIONS
For complete specifications see www.
samtec.
com?BHS
Z
(1,78) .
070 DIA (1,27) .
050 DIA (0,46) .
018 DIA
(1,78) .
070 DIA (0,46) .
018 DIA (3,18) .
125
Z
BHS
Same as BBS except: Insulator Material: Black Liquid Crystal Polymer RoHS Compliant: Yes Lead-Free Solderable: Wave, or reflow with all...
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