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CRF03

Toshiba Semiconductor

Switching Mode Power Supply Applications - Toshiba Semiconductor


CRF03
CRF03

PDF File CRF03 PDF File



Description
CRF03 TOSHIBA Fast Recovery Diode Silicon Diffused Type CRF03 Switching Mode Power Supply Applications • • • • Repetitive peak reverse voltage: VRRM = 600 V Average forward current: IF (AV) = 0.
7 A Low forward voltage: VFM = 2.
0 V (max.
) Very fast reverse-recovery time: trr = 100 ns (max.
) Unit: mm • Suitable for compact assembly due to its small surface-mount www.
DataSheet4U.
com package, the “S−FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristics Repetitive peak reverse voltage Average forward current Peak one-cycle surge forward current (non-repetitive) Junction temperature Storage temperature range Symbol VRRM IF(AV) IFSM Tj Tstg Rating 600 0.
7 (Note 1) 10 (50 Hz) −40~150 −40~150 Unit V A A °C °C JEDEC JEITA TOSHIBA ― ― 3-2A1A Note 1: Ta = 76°C: Device mounted on a ceramic board Board size: 50 mm × 50 mm, Soldering Land size: 2 mm × 2 mm Board thickness: 0.
64 t Rectangular waveform (α = 180°) Weight: 0.
013 g (typ.
) Note 2: Using continuously under heavy loads (e.
g.
the application of high temperature/current/voltage and the significant change in temperature, etc.
) may cause this product to decrease in the reliability significantly even if the operating conditions (i.
e.
operating temperature/current/voltage, etc.
) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.
e.
reliability test report and estimated failure rate, etc).
1 2006-11-07 CRF03 Electrical Characteristics (Ta = 25°C) Characteristics Peak forward voltage Repetitive peak reverse current Reverse recovery time Symbol VFM IRRM trr IFM = 0.
7 A VRRM = 600 V IF = 1 A, di/dt = −30 A/μs Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.
64 t) Thermal resistance Rth (j-a) Device mounted on a glass-epoxy board (board size: 50 mm × ...



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