DatasheetsPDF.com

CRF02

Toshiba Semiconductor

Power Supply Applications - Toshiba Semiconductor


CRF02
CRF02

PDF File CRF02 PDF File



Description
CRF02 TOSHIBA Fast Recovery Diode Silicon Diffused Type CRF02 Power Supply Applications Strobo Flasher Applications • • Repetitive peak reverse voltage: VRRM = 800 V Average forward current: IF (AV) = 0.
5 A Unit: mm • Low forward voltage: VFM = 3.
0 V (max.
) www.
DataSheet4U.
com • Very fast reverse-recovery time: trr = 100 ns (max.
) • Suitable for compact assembly due to its small surface-mount package, the “S−FLATTM” (Toshiba package name) Absolute Maximum Ratings (Ta = 25°C) Characteristics Repetitive peak reverse voltage Average forward current Peak one-cycle surge forward current (non-repetitive) Junction temperature Storage temperature range Symbol VRRM IF(AV) IFSM Tj Tstg Rating 800 0.
5 (Note 1) 10 (50 Hz) −40~150 −40~150 Unit V A A °C °C JEDEC JEITA TOSHIBA ― ― 3-2A1A Note 1: Ta = 84°C: Device mounted on a ceramic board Board size: 50 mm × 50 mm, Soldering Land size: 2 mm × 2 mm Board thickness: 0.
64 t Rectangular waveform (α = 180°) Weight: 0.
013 g (typ.
) Note 2: Using continuously under heavy loads (e.
g.
the application of high temperature/current/voltage and the significant change in temperature, etc.
) may cause this product to decrease in the reliability significantly even if the operating conditions (i.
e.
operating temperature/current/voltage, etc.
) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.
e.
reliability test report and estimated failure rate, etc).
1 2006-11-07 CRF02 Electrical Characteristics (Ta = 25°C) Characteristics Peak forward voltage Repetitive peak reverse current Repetitive peak reverse current Reverse recovery time Symbol VFM IRRM(1) IRRM(2) trr IFM = 0.
5 A VRRM = 400 V VRRM = 800 V IF = 1 A, di/dt = −30 A/μs Device mounted on a ceramic board (board size: 50 mm × 50 mm) (soldering land: 2 mm × 2 mm) (board thickness: 0.
64 t) Test Condition Min ...



Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)