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CUHS20S30

Toshiba

Schottky Barrier Diode - Toshiba


CUHS20S30
CUHS20S30

PDF File CUHS20S30 PDF File



Description
Schottky Barrier Diode Silicon Epitaxial CUHS20S30 1.
Applications • High-Speed Switching 2.
Packaging and Internal Circuit CUHS20S30 1: Cathode 2: Anode US2H 3.
Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Note Rating Unit Reverse voltage VR 30 V Average rectified current IO (Note 1) 2 A Non-repetitive peak forward surge current IFSM (Note 2) 10 A Junction temperature Tj 150  Storage temperature Tstg -55 to 150  Note: Using continuously under heavy loads (e.
g.
the application of high temperature/current/voltage and the significant change in temperature, etc.
) may cause this product to decrease in the reliability significantly even if the operating conditions (i.
e.
operating temperature/current/voltage, etc.
) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.
e.
reliability test report and estimated failure rate, etc).
Note 1: Mounted on an FR4 board.
(25.
4 mm × 25.
4 mm × 1.
6 mm, Cu Pad: 645 mm2) Note 2: Measured with a 10 ms pulse.
©2018 Toshiba Electronic Devices & Storage Corporation 1 Start of commercial production 2018-10 2018-10-30 Rev.
1.
0 4.
Electrical Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Forward voltage Reverse current Total capacitance Note 1: Pulse measurement.
Symbol Note Test Condition VF (1) VF (2) VF (3) IR (1) IR (2) Ct (Note 1) IF = 500 mA IF = 1 A IF = 2 A (Note 1) VR = 10 V VR = 30 V VR = 0 V, f = 1 MHz Min       CUHS20S30 Typ.
Max Unit 0.
25 0.
30 0.
28 0.
34 0.
34 0.
41 170  240 500 390  V µA pF 5.
Marking Marking Code 86 Fig.
5.
1 Marking Part Number CUHS20S30 6.
Usage Considerations • Schottky barrier diodes (SBDs) have reverse leakage greater than other types of diodes.
This makes SBDs more susceptible to thermal runaway under high-t...



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