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THGBMBG5D1KBAIL

Toshiba
Part Number THGBMBG5D1KBAIL
Manufacturer Toshiba
Description 4GB density e-MMC
Published Dec 29, 2016
Detailed Description THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module...
Datasheet PDF File THGBMBG5D1KBAIL PDF File

THGBMBG5D1KBAIL
THGBMBG5D1KBAIL

Overview
THGBMBG5D1KBAIL 4GB THGBMBG5D1KBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package.
This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use.
FEATURES THGBMBG5D1KBAIL Interface THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.
0 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection P-WFBGA153-1113-0.
50-001 (11.
5mm x 13mm, H0.
8mm max.
package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC N...


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