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THGBM4G6D2HBAIR

Toshiba
Part Number THGBM4G6D2HBAIR
Manufacturer Toshiba
Description 8GB e-MMC Module
Published Jun 21, 2016
Detailed Description Preliminary THGBM4G6D2HBAIR 8GB THGBM4G6D2HBAIR TOSHIBA e-MMC Module INTRODUCTION THGBM4G6D2HBAIR is 8-GByte density...
Datasheet PDF File THGBM4G6D2HBAIR PDF File

THGBM4G6D2HBAIR
THGBM4G6D2HBAIR

Overview
Preliminary THGBM4G6D2HBAIR 8GB THGBM4G6D2HBAIR TOSHIBA e-MMC Module INTRODUCTION THGBM4G6D2HBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package.
This unit utilizes advanced TOSHIBA NAND flash devices and a controller chip assembled as Multi Chip Module.
THGBM4G6D2HBAIR has an industry standard MMC protocol for easy use.
FEATURES THGBM4G6D2HBAIR Interface THGBM4G6D2HBAIR has the JEDEC/MMCA Version 4.
41 interface with either 1-I/O, 4-I/O and 8-I/O mode support.
Ball / Signal Allocation P-VFBGA153-1113-0.
50-002FP(A) (11.
5 x 13mm, H1.
0mm max.
package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC...


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