MASW-004240-13170W

MASW-004240-13170W HMIC™ SP4T Surface Mount Silicon PIN Diode Switch with Integrated Bias Network V1 Features ♦ Operating Freq. 10 ± 2GHz or 24 ± 2GHz ♦ Surface Mount Device ♦ Integrated Bias Network ♦ No Wire Bonds Required ♦ Low Current Consumption +12 mA for On State/0V for Off Condition ♦ Rugged, Glass Encapsulated Construction ♦ Fully Monolithic ♦ Polymer Scratch Protection ♦ RoHS Compliant Description The MASW-004240-13170W is a surface mount SP4T switch chip with integrated bias network. It utilizes M/A-COM technology Solutions HMICTM (Heterolithic Microwave Integrated Circuit) process, US Patent 5,268,310, which allows the incorporation of silicon pedestals that form series and shunt diodes or vias by imbedding them in low loss, low dispersion glass. By using small spacing between elements, this combination of silicon and glass gives HMIC devices low loss and high isolation performance with exceptional repeatability through low millimeter frequencies. Patterned gold backside metal allows for manual or re-flow soldering without the need for wire bond connections to the RF and bias ports. The chip may be soldered using 80Au/20Sn, RoHS compliant solders or electrically conductive silver epoxy. The RF bond pads are labeled J1-J5 and are 375x375µM (15x15mils) square. The DC bias bond pads are labeled B2-B5 and are also 375x375µM (15x15mils) square. Yellow areas denote backside soldering points for bias and RF connections. Parameter Operating Temperature Storage Tempera...