BZT52C6V2

BZT52C2V0 - BZT52C51 Surface mount zener diode FEATURES z Planar die construction. z 500mW power dissipation on ceramic PCB. z General purpose, medium current. z Ideally suited for automated assembly processes. Pb Lead-free APPLICATIONS z Zener diode. z Ultra-small surface mount package. ORDERING INFORMATION SOD-123 Type No. Marking Package Code BZT52C2V4-BZT52C51 See table 2 SOD-123 MAXIMUM RATING @ Ta=25℃ unless otherwise specified Characteristic Symbol Value Unit Forward Voltage @ IF=10mA Power Dissipation Thermal resistance,junction to ambient air VF Pd RθjA 0.9 500 305 V mW ℃/W Junction temperature Tj 150 ℃ Storage temperature range Tstg -65-150 ℃ Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm2 2. Short duration test pulse used to minimize self-heating effect. 3. When provided, otherwise, parts are provided with date code only, and type number identifications appears on reel only. 4. f = 1KHz MDD ELECTRONIC 201207 Surface mount zener diode BZT52C2V0-BZT52C51 ELECTRICAL CHARACTERISTICS @ Ta=25℃ unless otherwise specified Type Number BZT52C2V0 BZT52C2V4 BZT52C2V7 BZT52C3V0 BZT52C3V3 BZT52C3V6 BZT52C3V9 BZT52C4V3 BZT52C4V7 BZT52C5V1 BZT52C5V6 BZT52C6V2 BZT52C6V8 BZT52C7V5 BZT52C8V2 BZT52C9V1 BZT52C10 BZT52C11 BZT52C12 BZT52C13 BZT52C15 BZT52C16 BZT52C18 BZT52C20 BZT52C22 BZT52C24 BZT52C27 BZT52C30 BZT52C33 BZT52C36 BZT52C39 BZT52C43 BZT52C47 BZT52C51 Marking Code WY WX W1 W2 W3 W4 W5 W6 W7 W8 W9 WA...