SDM02U30CSP

O B S OALDEAVTDAEVN–ACNPECADNEREIDTNW IFDPNIONRFSRECOMWDROAUNMPT ICTARITOTOINNDOUUENCDT SDM02U30CSP 0.2A SCHOTTKY BARRIER DIODE CHIP SCALE PACKAGE Product Summary VRRM (V) 30 IO (mA) VF Max (V) @ +25°C IR Max (µA) @ +25°C 200 0.50 50 Description The SDM02U30CSP is a 30-Volt 0.2A Schottky Barrier Diode that is optimized for low forward voltage drop and low leakage current. It’s housed in a compact Chip Scale Package (CSP) that occupies only 0.18mm2 board space. The low thermal resistance enables designers to meet design challenges of increasing efficiency while reducing board space. It is ideally suited for use in portable applications. Features and Benefits  0.18mm2 Footprint, Off Board Profile of 0.28mm  Low Forward Voltage of 0.50V (Max) – Minimizes Power Dissipation Losses  Low Leakage – Maximizes Battery Power  Soft, Fast Switching Capability  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3) Applications  Blocking Diode  Reverse Protection Diode  Boost Diode Mechanical Data  Case: X3-WLB0603-2  Moisture Sensitivity: Level 1 per J-STD-020  Polarity Indicator: Cathode Dot  Terminals: NiAu Bump. Solderable per MIL-STD-202, Method 208 e4  Weight: 0.1mg (Approximate) X3-WLB0603-2 Top View Bottom View Ordering Information (Note 4) Notes: Part Number SDM02U30CSP-7 Case X3-WLB0603-2 Packaging 10,000/Tape & Reel 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (Ro...