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R5F213G4ANNP Dataheets PDF



Part Number R5F213G4ANNP
Manufacturers Renesas
Logo Renesas
Description MCU
Datasheet R5F213G4ANNP DatasheetR5F213G4ANNP Datasheet (PDF)

R8C/3GA Group RENESAS MCU REJ03B0235-0110 Rev.1.10 Sep. 10, 2009 1. Overview 1.1 Features The R8C/3GA Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. Thes.

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R8C/3GA Group RENESAS MCU REJ03B0235-0110 Rev.1.10 Sep. 10, 2009 1. Overview 1.1 Features The R8C/3GA Group of single-chip MCUs incorporates the R8C CPU core, employing sophisticated instructions for a high level of efficiency. With 1 Mbyte of address space, and it is capable of executing instructions at high speed. In addition, the CPU core boasts a multiplier for high-speed operation processing. Power consumption is low, and the supported operating modes allow additional power control. These MCUs are designed to maximize EMI/EMS performance. Integration of many peripheral functions, including multifunction timer and serial interface, reduces the number of system components. The R8C/3GA Group has data flash (1 KB × 4 blocks) with the background operation (BGO) function. 1.1.1 Applications Electronic household appliances, office equipment, audio equipment, consumer equipment, etc. REJ03B0235-0110 Rev.1.10 Sep. 10, 2009 Page 1 of 53 R8C/3GA Group 1. Overview 1.1.2 Specifications Tables 1.1 and 1.2 outline the Specifications for R8C/3GA Group. Table 1.1 Specifications for R8C/3GA Group (1) Item CPU Function Central processing R8C CPU core Specification unit • Number of fundamental instructions: 89 • Minimum instruction execution time: 50 ns (f(XIN) = 20 MHz, VCC = 2.7 to 5.5 V) 200 ns (f(XIN) = 5 MHz, VCC = 1.8 to 5.5 V) • Multiplier: 16 bits × 16 bits → 32 bits • Multiply-accumulate instruction: 16 bits × 16 bits + 32 bits → 32 bits • Operation mode: Single-chip mode (address space: 1 Mbyte) Memory ROM, RAM, Data Refer to Table 1.3 Product List for R8C/3GA Group. flash Power Supply Voltage detection • Power-on reset Voltage circuit • Voltage detection 3 (detection level of voltage detection 0 and voltage Detection I/O Ports detection 1 selectable) Programmable I/O • Input-only: 1 pin Clock ports Clock generation circuits • CMOS I/O ports: 19, selectable pull-up resistor • High current drive ports: 19 • 3 circuits: XIN clock oscillation circuit, XCIN clock oscillation circuit (32 kHz), Low-speed on-chip oscillator • Oscillation stop detection: XIN clock oscillation stop detection function • Frequency divider circuit: Dividing selectable 1, 2, 4, 8, and 16 • Low power consumption modes: Standard operating mode (high-speed clock, low-speed clock, low-speed on- Interrupts chip oscillator), wait mode, stop mode Real-time clock (timer RE) • Number of interrupt vectors: 69 • External Interrupt: 7 (INT × 3, Key input × 4) • Priority levels: 7 levels Watchdog Timer • 14 bits × 1 (with prescaler) • Reset start selectable DTC (Data Transfer Controller) • Low-speed on-chip oscillator for watchdog timer selectable • 1 channel Timer Timer RA • Activation sources: 23 • Transfer modes: 2 (normal mode, repeat mode) 8 bits × 1 (with 8-bit prescaler) Timer mode (period timer), pulse output mode (output level inverted every period), event counter mode, pulse width measurement mode, pulse period Timer RB measurement mode 8 bits × .


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