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NCP6360 Dataheets PDF



Part Number NCP6360
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Mini Buck Converter
Datasheet NCP6360 DatasheetNCP6360 Datasheet (PDF)

NCP6360 Mini Buck Converter for RF Power Amplifiers The NCP6360, a PWM synchronous step−down DC−to−DC converter, is optimized for supplying RF Power Amplifiers (PAs) used into 3G/4G wireless systems (Mobile/ Smart Phones, Phablets, Tablets, ...) powered by single−cell Lithium−Ion batteries. The device is able to deliver up to 800 mA. The output voltage is monitorable from 0.6 V to 3.4 V by an analog control pin VCON. The analog control allows dynamically optimizing the RF Power Amplifier’s effi.

  NCP6360   NCP6360


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NCP6360 Mini Buck Converter for RF Power Amplifiers The NCP6360, a PWM synchronous step−down DC−to−DC converter, is optimized for supplying RF Power Amplifiers (PAs) used into 3G/4G wireless systems (Mobile/ Smart Phones, Phablets, Tablets, ...) powered by single−cell Lithium−Ion batteries. The device is able to deliver up to 800 mA. The output voltage is monitorable from 0.6 V to 3.4 V by an analog control pin VCON. The analog control allows dynamically optimizing the RF Power Amplifier’s efficiency during a communication while for example in roaming situation with as a benefit an increased talk time. Also at light load for optimizing the DC−to−DC converter efficiency, the NCP6360 enters automatically in a PFM mode and operates in a slower switching frequency corresponding to a reduced quiescent current in regards to the PWM mode for which the device operates at a switching frequency of 6 MHz. Synchronous rectification offers improved system efficiency. The NCP6360 is available in a space saving, low profile 1.5 x 1.0 mm CSP−6 package. Features • Input Voltage from 2.7 V to 5.5 V for Battery Powered Applications • Adjustable Output Voltage (0.6 V to 3.4 V) • 6 MHz Switching Frequency • Uses 470 nH Inductor and 4.7 mF Capacitor for Optimized Footprint and Solution Thickness • PFM /PWM Automatic Mode Change for High Efficiency • Low 30 mA Quiescent Current • Thermal Protections to Avoid Damage of the IC • Small 1.5 x 1.0 mm / 0.5 mm Pitch CSP Package • This is a Pb−Free Device Typical Applications • 3G / 4G Wireless Systems, Smart Phones, Phablets and Webtablets www.onsemi.com WLCSP6, 1.00x1.50 CASE 568AN MARKING DIAGRAM 60 AYW G A = Assembly Location Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering, marking and shipping information on page 16 of this data sheet. VCON Voltage control From external DAC EN Processor or System Supply NCP6360 Vout Control Thermal Protection Enabling DCDC Buck 1.0 A 6.0 MHz FB PVIN VBAT (Battery or System Supply) 10 mF SW DCDC Out 0.47 mH PGND 4.7 mF Rev 0.00 Figure 1. NCP6360 Block Diagram © Semiconductor Components Industries, LLC, 2014 January, 2019 − Rev. 3 1 Publication Order Number: NCP6360/D DAC GPI/O NCP6360 VCON Voltage control From external DAC EN NCP6360 Vout Control Thermal Protection Enabling DCDC Buck 1.0 A 6.0 MHz VBAT FB PVIN Battery or System Supply 10 uF SW 0.47 uH DCDC Out PGND 4.7 uF Modem RF TX Power Envelop Detection RF IN 3G/4G PAs RF OUT Coupler Antenna Switch Figure 2. Typical Application 1.0 mm 1.5 mm A1 EN B1 VCON C1 FB A2 PVIN B2 SW C2 PGND Figure 3. Pin Out (Top View) www.onsemi.com 2 NCP6360 PIN FUNCTION DESCRIPTION Pin Name Type Description A1 EN Input Enable Control. Active high will enable the part. There is an internal pull down resistor on this pin. A2 PVIN Power DC−DC Power Supply. This pin must be decoupled to ground by a 10 mF and 1 mF ceramic Input capacitors. These capacitors should be placed as close as possible to this pin. B1 VCON Input Voltage Control Analog Input. This pin controls the output voltage. It must be shielded to protect against noise. VOUT = 2.5 x VCON B2 SW Power DC−DC Switch Power. This pin connects the power transistors to one end of the inductor. Typical Output application (6 MHz) uses 0.470 mH inductor; refer to application section for more information. C1 FB Power DC−DC Feedback Voltage. Must be connected to the output capacitor positive terminal. This is the Input input of the error amplifier. C2 PGND Ground DC−DC Power Ground. This pin is the power ground and carries high switching current. High quality ground must be provided to prevent noise spikes. To avoid high−density current flow in a limited PCB track, a local ground plane that connects all power grounds together is recommended. MAXIMUM RATINGS Rating Symbol Value Unit Analog and power pins: PVIN, SW, FB VCON pin Digital pin: EN: (Note 3) Input Voltage Input Current Operating Ambient Temperature Range Operating Junction Temperature Range (Note 1) Storage Temperature Range Maximum Junction Temperature Thermal Resistance Junction−to−Ambient (Note 2) Electrostatic Discharge (ESD) Protection, (Note 3) Human Body Model Charged Device Model VA VVCON VDG IDG TA TJ TSTG TJMAX RqJA HBM CDM −0.3 to + 7.0 −0.3 to + VA + 0.3 ≤ +7.0 −0.3 to VA +0.3 ≤ 7.0 10 −40 to +85 −40 to +125 −65 to + 150 −40 to +150 85 2.0 1.5 V V V mA °C °C °C °C °C/W kV Moisture Sensitivity (Note 4) MSL Level 1 Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The thermal shutdown set to 165°C (typical) avoids potential irreversible damage on the device due to power dissipatio.


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