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NCP3030B Dataheets PDF



Part Number NCP3030B
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Synchronous PWM Controller
Datasheet NCP3030B DatasheetNCP3030B Datasheet (PDF)

NCP3030A, NCP3030B, NCV3030A, NCV3030B Synchronous PWM Controller The NCP3030 is a PWM device designed to operate from a wide input range and is capable of producing an output voltage as low as 0.6 V. The NCP3030 provides integrated gate drivers and an internally set 1.2 MHz (NCP3030A) or 2.4 MHz (NCP3030B) oscillator. The NCP3030 also has an externally compensated transconductance error amplifier with an internally fixed soft−start. Protection features include lossless current limit and short .

  NCP3030B   NCP3030B



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NCP3030A, NCP3030B, NCV3030A, NCV3030B Synchronous PWM Controller The NCP3030 is a PWM device designed to operate from a wide input range and is capable of producing an output voltage as low as 0.6 V. The NCP3030 provides integrated gate drivers and an internally set 1.2 MHz (NCP3030A) or 2.4 MHz (NCP3030B) oscillator. The NCP3030 also has an externally compensated transconductance error amplifier with an internally fixed soft−start. Protection features include lossless current limit and short circuit protection, output overvoltage protection, output undervoltage protection, and input undervoltage lockout. The NCP3030 is currently available in a SOIC−8 package. Features • Input Voltage Range from 4.7 V to 28 V • 1.2 MHz Operation (NCP3030B – 2.4 MHz) • 0.8 V Internal Reference Voltage • Internally Programmed 1.8 ms Soft−Start (NCP3030B – 1.3 ms) • Current Limit and Short Circuit Protection • Transconductance Amplifier with External Compensation • Input Undervoltage Lockout • Output Overvoltage and Undervoltage Detection • NCV Prefix for Automotive and Other Applications Requiring Site and Change Controls • These are Pb−Free Devices www.onsemi.com 8 1 SOIC−8 NB CASE 751 MARKING DIAGRAM 8 3030x ALYW G 1 3030x A L Y W G = Specific Device Code x = A or B = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package VIN CIN CBST VCC BST HSDR Q1 PIN CONNECTIONS VCC COMP FB GND BST HSDR VSW LSDR COMP VSW L0 Vout ORDERING INFORMATION Device Package Shipping† RC CC1 FB LSDR Q2 RFB1 NCP3030ADR2G SOIC−8 2500 / Tape & Reel C0 (Pb−Free) CC2 GND RISET RFB2 NCP3030BDR2G SOIC−8 2500 / Tape & Reel (Pb−Free) Figure 1. Typical Application Circuit NCV3030ADR2G SOIC−8 2500 / Tape & Reel (Pb−Free) NCV3030BDR2G SOIC−8 2500 / Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2011 July, 2018 − Rev. 2 1 Publication Order Number: NCP3030/D NCP3030A, NCP3030B, NCV3030A, NCV3030B VCC INTERNAL BIAS POR/STARTUP THERMAL SD VC BOOST CLAMP COMP FB OSCILLATOR CLK/ DMAX/ SOFT START RAMP 1.5 V GATE DRIVE LOGIC REF OTA + − PWM COMP LEVEL SHIFT VCC CURRENT SAMPLE & LIMIT HOLD ISET VC + − OOV OUV + − Figure 2. NCP3030 Block Diagram BST_CHRG BST HSDR VSW LSDR GND PIN FUNCTION DESCRIPTION Pin Pin Name Description 1 VCC The VCC pin is the main voltage supply input. It is also used in conjunction with the VSW pin to sense current in the high side MOSFET. 2 COMP The COMP pin connects to the output of the Operational Transconductance Amplifier (OTA) and the positive terminal of the PWM comparator. This pin is used in conjunction with the FB pin to compensate the voltage mode control feedback loop. 3 FB The FB pin is connected to the inverting input of the OTA. This pin is used in conjunction with the COMP pin to compensate the voltage mode control feedback loop. 4 GND Ground Pin 5 LSDR The LSDR pin is connected to the output of the low side driver which connects to the gate of the low side N−FET. It is also used to set the threshold of the current limit circuit (ISET) by connecting a resistor from LSDR to GND. 6 VSW The VSW pin is the return path for the high side driver. It is also used in conjunction with the VCC pin to sense current in the high side MOSFET. 7 HSDR The HSDR pin is connected to the output of the high side driver which connects to the gate of the high side N−FET. 8 BST The BST pin is the supply rail for the gate drivers. A capacitor must be connected between this pin and the VSW pin. www.onsemi.com 2 NCP3030A, NCP3030B, NCV3030A, NCV3030B ABSOLUTE MAXIMUM RATINGS (measured vs. GND pin 8, unless otherwise noted) Rating Symbol High Side Drive Boost Pin BST Boost to VSW differential voltage BST−VSW COMP COMP VMAX 45 13.2 5.5 VMIN −0.3 −0.3 −0.3 Unit V V V Feedback High−Side Driver Output Low−Side Driver Output Main Supply Voltage Input Switch Node Voltage Maximum Average Current VCC, BST, HSDRV, LSDRV, VSW, GND Operating Junction Temperature Range (Note 1) Maximum Junction Temperature Storage Temperature Range Thermal Characteristics − SOIC−8 Plastic Package (Note 2) Thermal Resistance Junction−to−Air (Note 3) FB HSDR LSDR VCC VSW Imax TJ TJ(MAX) Tstg RqJA 5.5 −0.3 40 −0.3 13.2 −0.3 40 −0.3 40 −0.6 130 −40 to +140 +150 −55 to +150 110 165 V V V V V mA °C °C °C °C/W Lead Temperature Soldering (10 sec): Reflow (SMD styles only) Pb−Free RF 260 Peak °C (Note 4) Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. The maximum package power dissipation limit must not be exceeded. TJ(m.


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