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FFMAF201 Dataheets PDF



Part Number FFMAF201
Manufacturers LRC
Logo LRC
Description Surface Mount Glass Passivated Junction Fast Recovery Rectifiers
Datasheet FFMAF201 DatasheetFFMAF201 Datasheet (PDF)

FFMAF201 thru FFMAF207T Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 2.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * Typical IR less than 1.0µA * High temperature soldering guaranteed: 260°C/10 seconds Mechanical Data Case: JEDEC SM.

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FFMAF201 thru FFMAF207T Surface Mount Glass Passivated Junction Fast Recovery Rectifiers Reverse Voltage 50 to 1000V Forward Current 2.0A FEATURES * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * High temperature metallurgically bonded construction * Cavity-free glass passivated junction * Capable of meeting environmental standards of MIL-S-19500 * Typical IR less than 1.0µA * High temperature soldering guaranteed: 260°C/10 seconds Mechanical Data Case: JEDEC SMA-FL, molded plastic over glass DIE Terminals: Plated leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denotes cathode end Mounting Position: Any Weight: 0.0327g Handling precautin:None We declare that the material of product is Haloggen free (green epoxy compound) Electrical Characteristic 1.Maximum & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol FFMAF 201 FFMAF 202 FFMAF 203 FFMAF 204 FFMAF 205 FFMAF 206 FFMAF 207 FFMAF 207P FFMAF 207T Device marking code FF21 FF22 FF23 FF24 FF25 FF26 FF27 FF27P FF27T Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage VRRM 50 100 200 400 600 800 1000 1000 1000 VRMS 35 70 140 280 420 560 700 700 700 VDC 50 100 200 400 600 800 1000 1000 1000 Maximum average forward rectified current lead length at TC = 75°C(Note 2) IF(AV) 2.0 Peak forward surge current 8.3ms single half sinewave superimposed on rated load (JEDEC Method) IFSM 60 Typical reverse recovery time (Note 1) Typical thermal resistance (Note 2) Operating junction temperature range storage temperature range trr RθJA RθJC TJ TSTG 150 250 500 250 160 150 25 –55 to +150 –65 to +175 Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified. Parameter Symbol symbol FFMAF 201 FFMAF 202 FFMAF 203 FFMAF 204 FFMAF 205 FFMAF 206 Maximum instantaneous forward voltage at 2.0A VF 1.3 Maximum DC reverse current TJ= 25°C at rated DC blocking voltage TJ = 125°C IR 5.0 100 FFMAF 207 FFMAF 207P FFMAF 207T Typical junction capacitance at 4.0V, 1MHz (Note 2) CJ 15.0 NOTES: 1. IF = 0.5A, IR = 1.0A, IRR = 0.25A 2. 8.0mm2 (.013mm thick) land areas Unit V V V A A ns °C/W °C °C Unit V µA PF FFMAF201 thru FFMAF207T 2. Characteristic Curves ( TA = 25°C unless otherwise noted ) Fig. 1 – Forward Current Derating Curve Fig. 2 – Maximum Non-repetitive Peak Forward Surge Current 60 Hz Resistive or 2.0 Inductive Load TJ = TJ max 8.3ms Single Half Sine-wave 60 (JEDEC Method) Average Forward Rectified Current (A) Average Forward Rectified Current (A) Instantaneous Forward Current (A) 1.0 0.375" (9.5mm) Lead Length 0 0 25 50 75 100 125 150 175 Case Temperature, °C Fig 3. – Typical Instantaneous Forward 10 Characteristics 1.0 0.1 0.01 TJ = 25°C Pulse width = 300µs 1% Duty Cycle 0.001 0.6 0.8 1.0 1.2 1.4 Instantaneous Forward Voltage Fig 5. –typical transient thermal 1000 impedance 1.6 100 10 1 0.01 0.1 1.0 10 t,Pulse duration,sec 100 Junction Capacitance (pF) Instantaneous Reverse Current (µA) 30 0 1 10 Number of Cycles at 60Hz 100 Fig 4. – Typical Reverse Characteristics 100 10 Tj=125℃ 1.0 Tj=75℃ 0.1 Tj=25℃ 0.01 0 20 40 60 80 100 Percent of Rated Peak Reverse Voltage (%) Fig 6. – Typical Junction Capacitance 100 10 TJ = 25°C f = 1.0 MHz Vsig = 50mVp-p 1.0 0.1 1 10 Reverse Voltage (V) Transient thermal impedance(°C/W) 3. dimension: FFMAF201 thru FFMAF207T SMA-FL DIM MILLIMETERS MIN MAX INCHES MIN MAX A 4.4 4.8 0.173 0.189 B 1.3 1.5 0.051 0.059 C 3.3 3.7 0.130 0.146 D 2.3 2.7 0.091 0.106 E 0.90Typ 0.035Typ H 0.9 1.2 0.036 0.047 J 0.11 0.21 0.005 0.009 Suggested solder pad layout SMA-FL Title : Power Diode SMD Package Pa cking Spec DOC NO.: WI-258 Version: 5 Modification: 0 Page: 2 5.1 、SMD Packing Reel Spec & Packing Quantity 5.1.1 Reel Packing A. Reel Spec unit:mm SPEC A SMA-FL 7" reel 177.0±2.0 TO277 13" reel 330.0±2.0 SOD123FL 7" reel 177.0±2.0 SOD323HE 7" reel 177.0±2.0 SMB-FL 13" reel 330.0±2.0 B. 13" reel packing box B 54.0±0.5 75.0±0.5 50.0±0.5 50.0±0.5 75.0±0.5 C 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 13.0±0.5 W 13.2±0.2 13.2±0.2 9.4±1.5 9.4±1.5 13.2±0.2 Quantity/Reel 3K 5K 3K 3K 5K unit:mm size A 335±5.0 as per above packing Spec TO277 13" reel SMB-FL 13" reel B 335±2.0 Q'ty/Box 10K 10K C 40±1.0 Title : Power Diode SMD Package Packing Spec C. 7" reel packing box DOC NO.: WI-258 DOC NO.: WI-258 Page: 3 D. reel packing carton 5.1.2 Tape Spec A. Cover Tape unit:mm SMA-FL SOD123FL SOD323HE A 186±2.0 B 139±2.0 C 185±2.0 as per above packing Q'ty/Box SMA-FL 30K SOD123FL 30K SOD323HE unit:mm 30K size A 350±2.0 B 340±2.0 as per above packing Spec TO277 13" reel SMB-FL 13" reel Q'ty/Carton 80K 80K C 350±2.0 unit:mm SMA-FL SOD123FL SOD323HE A 455±2.0 B 400±2.0 C 410±2.0 as per above packing Spec SMA-FL 7" reel SOD123-FL 7" reel SOD323HE 7" reel Q'ty/Carton .


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