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BZT55C11 Dataheets PDF



Part Number BZT55C11
Manufacturers Formosa MS
Logo Formosa MS
Description SMD Zener Diode
Datasheet BZT55C11 DatasheetBZT55C11 Datasheet (PDF)

SMD Zener Diode BZT55 Series Formosa MS List List.. 1 Package outline.... 2 Features 2 Mechanical data.... 2 Maximum ratings ....

  BZT55C11   BZT55C11



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SMD Zener Diode BZT55 Series Formosa MS List List................................................................................................. 1 Package outline............................................................................... 2 Features.......................................................................................... 2 Mechanical data............................................................................... 2 Maximum ratings ............................................................................. 2 Electrical characteristics................................................................... 3~4 Rating and characteristic curves........................................................ 5 Pinning information...........................................................................6 Suggested solder pad layout............................................................. 6 Packing information.......................................................................... 7 Reel packing.................................................................................... 8 Suggested thermal profiles for soldering processes............................. 8 High reliability test capabilities...........................................................9 http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 1 Document ID Issued Date DS-221735 2009/08/10 Revised Date 2010/05/10 Revision C Page. 9 SMD Zener Diode BZT55 Series 500mW Surface Mount Zener Diodes - 2.0V-51V Features • Silicon epitaxial planar chip structure. • Zener Breakdown Voltage Range, 2.4V to 51V ex.BZT55C2V4 • Zener Breakdown Voltage Range, 2.0V to 36V ex.BZT55B2V0 • Small package size for high density applications. • Ideally suited for automated assembly processes. • Pb-Free package is available. • Suffix "-H" indicates Halogen-free parts, ex.BZT55C2V4-H. 0.071(1.80) 0.055(1.40) Formosa MS Package outline SOD-123F 0.110(2.80) 0.098(2.50) 0.028(0.70) 0.019(0.50) Mechanical data • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-123F • Terminals :Plated terminals, solderable per MIL-STD-750, Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.010 gram 0.008(0.20)MAX 0.053(1.35) 0.037(0.95) 0.154(3.90) 0.141(3.60) Dimensions in inches and (millimeters) Maximum ratings (at TA=25oC unless otherwise noted) PARAMETER CONDITIONS Forward voltage @IF = 10mA Total power dissipation Thermal resistance at TA=25oC Mounted on FR-5 board, note1 Junction to ambient, note1 Junction to case, note1 Operating junction temperature range Storage temperature range Note1.Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad area 25mm2 Symbol MIN. VF PD RθJA RθJC TJ TSTG -55 -55 TYP. 305 200 MAX. 0.9 500 +150 +150 UNIT V mW OC/W OC/W oC oC http://www.formosams.com/ TEL:886-2-22696661 FAX:886-2-22696141 Page 2 Document ID Issued Date DS-221735 2009/08/10 Revised.


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