Document
SANGDEST MICROELECTRONICS
MBRF4080CT MBRF4090CT MBRF40100CT
Technical Data
Green Products
Data Sheet N0083, Rev. A
MBRF4080CT/MBRF4090CT/MBRF40100CT
Applications:
SCHOTTKY RECTIFIER
• Switching power supply • Converters • Free-Wheeling diodes • Reverse battery protection • Center tap configuration
Features:
• 150°C TJ operation • Center tap configuration • Low forward voltage drop • High purity, high temperature epoxy encapsulation for enhanced
mechanical strength and moisture resistance • High frequency operation • Guard ring for enhanced ruggedness and long term reliability • This is a Pb − Free Device • All SMC parts are traceable to the wafer lot • Additional testing can be offered upon request
OUTLINE DRAWING
Mechanical Dimensions: In Inches / mm
OPTION 1
OPTION 2
Dim Min Max Min
Max
A
4.4 4.6 4.30
4.70
b
0.6TYP
0.50
0.75
b1
1.3TYP
1.30
1.40
b2
1.7TYP
1.70
1.80
b3
1.6TYP
1.50
1.75
b4
1.2TYP
1.10
1.35
C
0.60TYP
0.50
0.75
D 14.8 15.1 14.80 15.20
E 10.06 10.26 9.96 10.36
e 2.55TYP
2.54TYP
F
2.9 3.1 2.80
3.20
G
6.5 6.9 6.50
6.90
L 12.7 13.7 12.8 13.2
L1 3.4 3.8 3.60 4.00
L2 2.6 3.0
-
-
Q
2.5 2.9 2.50
2.90
Q1 2.5 2.9
2.70REF
ØR 3.5REF
3.50REF
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
SANGDEST MICROELECTRONICS
Technical Data Data Sheet N0083, Rev. A
MBRF4080CT MBRF4090CT MBRF40100CT
Green Products
OPTION 3
OPTION 4
Dim Min Max Min Max
A
4.53
4.93 4.50 4.90
b
0.71
0.91 0.70 0.90
b1
1.15
1.39 1.33 1.47
C
0.36
0.53 0.45 0.60
D 15.67 16.07 15.67 16.07
E 9.96 10.36 9.96 10.36
e 2.54TYP
2.54 BSC
F
2.34
2.76 2.34 2.74
G
6.50
6.90 6.48 6.88
L 12.37 12.77 12.78 13.18
L1
2.23
2.63 3.03 3.43
Q
2.56
2.96 2.56 2.96
Q1
3.10
3.50 3.10 3.50
ØR
2.98
3.38 3.08 3.28
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
SANGDEST MICROELECTRONICS
Technical Data Data Sheet N0083, Rev. A
MBRF4080CT MBRF4090CT MBRF40100CT
Green Products
OPTION 5 (SR) ITO-220AB
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
SANGDEST MICROELECTRONICS
Technical Data Data Sheet N0083, Rev. A
Marking Diagram:
MBRF4080CT MBRF4090CT MBRF40100CT
Green Products
Where XXXXX is YYWWL
MBR F 40 80 CT SSG YY WW L
= Device Type = Package type = Forward Current (40A) = Reverse Voltage (80V) = Configuration = SSG = Year = Week = Lot Number
Cautions:Molding resin Epoxy resin UL:94V-0
Ordering Information:
Device
MBRF4080CT MBRF4090CT MBRF40100CT
Package
ITO-220AB (Pb-Free)
Shipping 50pcs / tube
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification.
Maximum Ratings:
Characteristics Peak Inverse Voltage
Average Forward
Peak One Cycle NonRepetitive Surge Current (per leg)
Symbol VRWM
Condition -
IF(AV) IFSM
50% duty cycle @TC =135°C, rectangular wave form
8.3 ms, half Sine pulse
Max. 80 MBRF4080CT 90 MBRF4090CT 100 MBRF40100CT
20(Per leg) 40(Per device)
Units V
A
280 A
• Weiqi Street, Airport Development Zone, Jiangning District, Nanjing, China 211113 (86) 25-87123907 • • FAX (86) 25-87123900 • World Wide Web Site - http://www.sangdest.com.cn • E-Mail Address - sales@ sangdest.com.cn •
SANGDEST MICROELECTRONICS
Technical Data Data Sheet N0083, Rev. A
Electrical Characteristics:
MBRF4080CT MBRF4090CT MBRF40100CT
Green Products
Characteristics Forward Voltage Drop*
Reverse Current (per leg)*
Junction Capacitance (per leg) Typical Series Inductance (per leg) Voltage Rate of Change RSM Isolation Voltage (t = 1.0 second, R. H. < =30%, TA = 25 °C)
* Pulse Width < 300µs, Duty Cycle <2%
Symbol VF1
VF2
IR1 IR2 CT LS dv/dt VISO
Condition
@ 10A, Pulse, TJ = 25 °C @ 20A, Pulse, TJ = 25 °C @ 40A, Pulse, TJ = 25 °C @ 10A, Pulse, TJ = 125 °C @ 20A, Pulse, TJ = 125 °C @ 40 A, Pulse, TJ = 125 °C @VR = rated VR TJ = 25 °C @VR = rated VR TJ = 125 °C @VR = 5V, TC = 25 °C fSIG = 1MHz Measured lead to lead 5 mm from package body
-
Clip mounting, the epoxy body away from the heatsink edge by more than 0.110" along the lead direction.
Clip mounting, the epoxy body is inside the heatsink.
Screw mounting, the epoxy body is inside the heatsink.
Typ. 0.72 0.79 0.88 0.63 0.70 0.80 0.006
0.09
363
-
-
-
-
Max. 0.80 0.88 1.02 0.70 0.74 0.88 1.0
6
400
8.0
10,000 4500
3500
1500
Units V
V
mA mA pF nH V/µs V
Thermal-Mechanical Specifications:
Characteristics Max. Junction Temperature
Max. Storage Temperature
Maximum Thermal Resistance Junction to Case (per leg) Ap.