XC2VP40

Product Not Recommended For New Designs 1 R Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Complete Data Sheet DS083 (v5.0) June 21, 2011 0 Product Specification Module 1: Introduction and Overview 10 pages Summary of Features General Description Architecture IP Core and Reference Support Device/Package Combinations and Maximum I/O Ordering Information Module 2: Functional Description 60 pages Functional Description: RocketIO™ X Multi-Gigabit Transceiver Functional Description: RocketIO Multi-Gigabit Transceiver Functional Description: Processor Block Functional Description: PowerPC™ 405 Core Functional Description: FPGA - Input/Output Blocks (IOBs) - Digitally Controlled Impedance (DCI) - On-Chip Differential Termination - Configurable Logic Blocks (CLBs) - 3-State Buffers - CLB/Slice Configurations - 18-Kb Block SelectRAM™ Resources - 18-Bit x 18-Bit Multipliers - Global Clock Multiplexer Buffers - Digital Clock Manager (DCM) Routing Configuration Module 3: DC and Switching Characteristics 59 pages Electrical Characteristics Performance Characteristics Switching Characteristics Pin-to-Pin Output Parameter Guidelines Pin-to-Pin Input Parameter Guidelines DCM Timing Parameters Source-Synchronous Switching Characteristics Module 4: Pinout Information 302 pages Pin Definitions Pinout Tables - FG256/FGG256 Wire-Bond Fine-Pitch BGA Package - FG456/FGG456 Wire-Bond Fine-Pitch BGA Package - FG676/FGG676 Wire-Bond Fine-Pitch BGA P...