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HB56D136BW Dataheets PDF



Part Number HB56D136BW
Manufacturers Hitachi Semiconductor
Logo Hitachi Semiconductor
Description High Density Dynamic RAM Module
Datasheet HB56D136BW DatasheetHB56D136BW Datasheet (PDF)

HB56D136 Series 1,048,576-word × 36-bit High Density Dynamic RAM Module ADE-203-209A (Z) Rev 1.0 Sept. 20, 1994 Description The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D136 is 72-pin single in-line package. Therefore, the HB56D136 makes high density mounting possible without surface mount technology. The HB56D136 provides common d.

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HB56D136 Series 1,048,576-word × 36-bit High Density Dynamic RAM Module ADE-203-209A (Z) Rev 1.0 Sept. 20, 1994 Description The HB56D136 is a 1-M × 36-bit dynamic RAM module, mounted 8 pieces of 4 Mbit DRAM (HM514400CS/CLS) sealed in SOJ package and 2 pieces of 2 Mbit DRAM (HM512200BS/BLS) sealed in SOJ package. An outline of the HB56D136 is 72-pin single in-line package. Therefore, the HB56D136 makes high density mounting possible without surface mount technology. The HB56D136 provides common data inputs and outputs. Decoupling capacitors are mounted beneath each SOJ. Features • 72-pin — Lead pitch: 1.27 mm • Single 5 V (±5%) supply • High speed — Access time: 60 ns/70 ns/80 ns (max) • Low power dissipation — Active mode: 5.46 W/4.94 W/4.41 W (max) — Standby mode: 105 mW (max) 5.25 mW (max) (L-version) • Fast page mode capability • 1,024 refresh cycle: 16 ms 128 ms (L-version) • 3 variations of refresh — RAS only refresh — CAS-before-RAS refresh — Hidden refresh • TTL compatible HB56D136 Series Ordering Information Type No. HB56D136BW-6C HB56D136BW-7C HB56D136BW-8C HB56D136BW-6CL HB56D136BW-7CL HB56D136BW-8CL HB56D136SBW-6C HB56D136SBW-7C HB56D136SBW-8C HB56D136SBW-6CL HB56D136SBW-7CL HB56D136SBW-8CL Access Time 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns 60 ns 70 ns 80 ns Package 72-pin SIP socket type Contact Pad Gold 72-pin SIP socket type Solder 2 Pin Arrangement HB56D136 Series Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Pin Name VSS DQ0 DQ18 DQ1 DQ19 DQ2 DQ20 DQ3 DQ21 VCC NC A0 A1 A2 A3 A4 A5 A6 1 pin 36 pin 37 pin 72 pin Pin No. 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 Pin Name NC DQ4 DQ22 DQ5 DQ23 DQ6 DQ24 DQ7 DQ25 A7 NC VCC A8 A9 NC RAS2 DQ26 DQ8 Pin No. 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 Pin Name DQ17 DQ35 VSS CAS0 CAS2 CAS3 CAS1 RAS0 NC NC WE NC DQ9 DQ27 DQ10 DQ28 DQ11 DQ29 Pin No. 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 Pin Name DQ12 DQ30 DQ13 DQ31 VCC DQ32 DQ14 DQ33 DQ15 DQ34 DQ16 NC PD1 PD2 PD3 PD4 NC VSS 3 HB56D136 Series Pin Description Pin Name Function A0 – A9 Address input A0 – A9 Refresh address input DQ0 – DQ35 Data-in/data-out CAS0 – CAS3 Column address strobe RAS0, RAS2 Row address strobe WE Read/write enable VCC VSS PD1 – PD4 Power supply (+5 V) Ground Presence detect pin NC No connection Presence Detect Pinout Pin No. 67 68 69 70 Pin Name PD1 PD2 PD3 PD4 HB56D136 60 ns 70 ns VSS VSS VSS VSS NC VSS NC NC 80 ns VSS VSS NC VSS 4 Block Diagram HB56D136 Series RAS0 CAS0 DQ0 – DQ3 DQ4 – DQ7 4 4 DQ8 DQ17 DQ9 4 – DQ12 4 DQ13 – DQ16 RAS2 CAS2 DQ18 – DQ21 DQ22 – DQ25 4 4 DQ26 DQ35 DQ27 4 – DQ30 4 DQ31 – DQ34 CAS RAS OE I/O1 D0 –I/O4 CAS RAS OE I/O1 D1 –I/O4 CAS1 RAS OE I/O1 I/O2 M0 CAS2 OE RAS CAS I/O1 D2 –I/O4 OE RAS CAS I/O0 D3 –I/O4 CAS RAS OE I/O1 D4 –I/O4 CAS RAS OE I/O1 D5 –I/O4 CAS1 RAS OE I/O1 I/O2 M1 CAS2 OE RAS CAS I/O1 D6 –I/O4 OE RAS CAS I/O0 D7 –I/O4 CAS1 CAS3 A0 to A9 WE .


HB56D136 HB56D136BW OD7015-12MB


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