CBM4083

CBM4083 Wafer Specification Rev 1.0 CBM4083 Wafer Specification - 1 - 04/12/2009 Date 2009-12-04 Revision History Rev No 1.0 Description Initial release CBM4083 Wafer Specification - 2 - 04/12/2009 Contents 1 PAD CONFIGURATION...............................................................................................................4 2 DIE INFORMATION TABLE ........................................................................................................4 3 CHIP WINDOWS SIZE ................................................................................................................5 4 PAD INFORMATION TABLE.......................................................................................................5 5 COPYRIGHT NOTICE .................................................................................................................7 CBM4083 Wafer Specification - 3 - 04/12/2009 1 PAD Configuration 2 Die Information Table Die Size PAD Pitch Typical PAD Size Special PAD Size 1583.52 X 1690.44 um 76 um 66 × 70.4 um 11pin,13pin(158×70.4 um);12pin(244×70.4 um);15pin(309×70.4 um). CBM4083 Wafer Specification - 4 - 04/12/2009 3 Chip Windows Size Top Left Corner (um) Bottom Left Corner(um) ( -11.17, 1679.27 ) ( -11.17, -11.17 ) Top Right Corner(um) Bottom Right Corner (um) 4 PAD Information Table NO. Pad Name 1 EEP_DATA 2 X_LED 3 REXT 4 VD33P 5 DP 6 DM 7 VS33P 8 XI 9 XO 10 VDDU 11 VSS 12 VDD50 13 VDD33 14 VDD18 15 VDD33C 16 MS_INS 17 SD_INS 18 CF_I...