Document
Zener Diodes
Zener Diodes CDZ55B-S Series
CHIP DIODE
CDZ55B-S Series
1:6
FEATURES
Silicon planar power zener diodes SMD chip pattern, available in various dimension included 1206 (CDZ55B series) Leadfree and RoHS compliance components
MECHANICAL CHARACTERISTICS
Size: 0805 Weight: approx. 6mg Marking: Zener voltage & cathode terminal
DIMENSIONS
Dimension/mm L W T C
0805
2.0±0.2 1.25±0.2 0.85±0.1 0.45±0.2
MAXIMUM RATING & THERMAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Symbol
Power Dissipation
Repetitive Peak Forward Current
Junction Temperature Thermal Resistance Junction to Ambient air Operating & Storage Temperature range
Ptot
IFRM
Tj RθJA Topr, stg
1) Valid provided that electrodes are kept at ambient temperature.
Value
500 200 150 300 -55 to 150
Unit
mW
mA oC oC/W oC
Ref No: CDZ55B-S V3.1 MRR 19, 2012
www.lizgroup.com
Zener Diodes
CHIP DIODE
CDZ55B-S Series
2:6
ELECTRICAL CHARACTERISTICS1)
Parameter at Tamb=25oC1)
Forward Voltage at IF=200mA Zener Voltage Tolerance, B=±2%
Symbol VF
1) Valid provided that electrodes are kept at ambient temperature.
Value 1.5 MAX
Unit V
Part Number
CDZ55B2V4S CDZ55B2V7S CDZ55B3V0S CDZ55B3V3S CDZ55B3V6S CDZ55B3V9S CDZ55B4V3S CDZ55B4V7S CDZ55B5V1S CDZ55B5V6S CDZ55B6V2S CDZ55B6V8S CDZ55B7V5S CDZ55B8V2S CDZ55B9V1S CDZ55B10S CDZ55B11S CDZ55B12S CDZ55B13S CDZ55B15S CDZ55B16S CDZ55B18S CDZ55B20S CDZ55B22S CDZ55B24S CDZ55B27S CDZ55B30S CDZ55B33S CDZ55B36S CDZ55B39S CDZ55B43S CDZ55B47S CDZ55B51S CDZ55B56S CDZ55B62S
Marking Code
2V4 2V7
3 3V3 3V6 3V9 4V3 4V7 5V1 5V6 6V2 6V8 7V5 8V2 9V1 10 11 12 13 15 16 18 20 22 24 27 30 33 36 39 43 47 51 56 62
Nominal Zener Voltage
VZ @ IZT Min V Max V 2.35 2.45 2.65 2.75 2.94 3.06 3.23 3.37 3.53 3.67 3.82 3.98 4.21 4.39 4.61 4.79 5.00 5.20 5.49 5.71 6.08 6.32 6.66 6.94 7.35 7.65 8.04 8.36 8.92 9.28 9.80 10.20 10.78 11.22 11.76 12.24 12.74 13.26 14.70 15.30 15.68 16.32 17.64 18.36 19.60 20.40 21.56 22.44 23.52 24.48 26.46 27.54 29.40 30.60 32.34 33.66 35.28 36.72 38.22 39.78 42.14 43.86 46.06 47.94 49.98 52.02 54.88 57.12 60.76 63.24
Max Zener Impedance
ZZT @ IZT Ω mA 85 5 85 5 85 5 85 5 85 5 85 5 80 5 70 5 50 5 30 5 10 5 85 75 75 10 5 15 5 20 5 20 5 26 5 30 5 40 5 50 5 55 5 55 5 80 5 80 5 80 5 80 5 80 5 90 2.5 90 2.5 110 2.5 125 2.5 135 2.5 150 2.5
ZZK @ IZK Ω mA 600 1 600 1 600 1 600 1 600 1 600 1 600 1 600 1 550 1 450 1 200 1 150 1 50 1 50 1 50 1 70 1 70 1 90 1 110 1 110 1 170 1 170 1 220 1 220 1 220 1 220 1 220 1 220 1 220 1 500 0.5 600 0.5 700 0.5 700 0.5 1000 0.5 1000 0.5
Max Reverse Leakage Current IR @ VR
µA V 50 1 10 1 41 21 21 21 11 0.5 1 0.1 1 0.1 1 0.1 2 0.1 3 0.1 5 0.1 6.2 0.1 6.8 0.1 7.5 0.1 8.2 0.1 9.1 0.1 10 0.1 11 0.1 12 0.1 13 0.1 15 0.1 16 0.1 18 0.1 20 0.1 22 0.1 24 0.1 27 0.1 29.3 0.1 32.3 0.1 35.3 0.1 38.3 0.1 42 0.1 46.5
Ref No: CDZ55B-S V3.1 MRR 19, 2012
www.lizgroup.com
CDZ55B68S CDZ55B75S
CHIP DIODE
Zener Diodes
CDZ55B-S Series
3:6
68
66.64 69.36 200
2.5 1000 0.5
0.1
51
75
73.50 76.50 250
2.5 1500 0.5
0.1 56.3
IF/ mA . Ptot-Admissible Power Dissipation/ mW
TYPICAL CHARACTERISTICS
Figure 1. Forward current vs Forward Voltage
200
180
160
140
120
100
80
60
40
20
0 0.6 0.7 0.8 0.9
1
VF/ V
1.1 1.2
Figure 2. Power De-rating
600 500 400 300 200 100
0 0 20 40 60 80 100 120 140 160 180 200
Tamb-Ambient Temperature/oC
TEST CHARACTERISTICS
Test Item Solderability Resistance to Soldering Heat Humidity Steady State Continue Forward Operating Life Thermal Shock Bending Strength
Test Condition Sn bath at 245±5oC for 2±0.5s
Sn bath at 260±5oC for 10±2s
At 85oC 85%RH for 168hrs
At 25oC IF =1.1IF for 1000hrs -55 ±5oC/5min to 150±5oC/5min for 10cycles Bending up to 2mm for 1cycle
Requirement
>95% area tin covered VZ, ZZT, ZZK, IR & VF within spec; no mechanical damage VZ, ZZT, ZZK, IR & VF within spec
VZ, ZZT, ZZK, IR & VF within spec
VZ, ZZT, ZZK, IR & VF within spec VZ, ZZT, ZZK, IR & VF within spec; no mechanical damage
APPLICATIONS
Ref No: CDZ55B-S V3.1 MRR 19, 2012
www.lizgroup.com
Zener Diodes
CHIP DIODE
CDZ55B-S Series
4:6
Function: constant voltage control Soldering Condition:
Soldering Condition & Caution ■ Recommended Soldering Condition (Refer to IPC/JEDEC J-STD-020D 4-1&5.2)
Recommended Profile Condition
Sn-Pb Soldering
Ramp-up rate (from pre-heat stage) Pre-heat Temperature & Time
Soldering Temperature & Time
Peak Temperature Time within 5oC of peak temperature Ramp-down rate Time 25oC to peak temperature
<3oC/s 100-150 oC
60-120s 183 oC
60-150s 230±5oC <260oC
10-20s <6oC/s
<6min
Leadfree
Soldering <3oC/s 150-200 oC
60-120s 217 oC
60-150s 245±5oC <260oC
20-30s <6oC/s
<8min
Wave Soldering
△T<150oC 100-150 oC
60-120s 260±5oC
5±2s
260±5oC
<6oC/s
-
Manual Soldering: Approx. 350oC for 3s, avoid solder iron tip direct touch the components body
Recommended Soldering Profile
T/oC
Fig1: Reflow soldering profile for lead-free solder (SnAgCu)
Ref No: CDZ55B-S V3.1 MRR 19, 2012
t/s www.lizgroup.com
Zener Diodes
CHIP DIODE
CDZ55B-S S.