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MAX2667 Dataheets PDF



Part Number MAX2667
Manufacturers Maxim Integrated
Logo Maxim Integrated
Description GPS/GNSS Ultra-Low-Noise-Figure LNAs
Datasheet MAX2667 DatasheetMAX2667 Datasheet (PDF)

EVALUATION KIT AVAILABLE MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs General Description The MAX2667/MAX2669 high-gain, low-noise amplifiers (LNAs) are designed for GPS L1, Galileo, and GLONASS applications. Designed in Maxim’s advanced SiGe process, the devices achieve a high gain and our lowest noise figure, while maximizing the input-referred 1dB compression point and the 3rd-order intercept point. The devices operate from a +1.6V to +3.3V single supply. The MAX2667 is optimized for.

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EVALUATION KIT AVAILABLE MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs General Description The MAX2667/MAX2669 high-gain, low-noise amplifiers (LNAs) are designed for GPS L1, Galileo, and GLONASS applications. Designed in Maxim’s advanced SiGe process, the devices achieve a high gain and our lowest noise figure, while maximizing the input-referred 1dB compression point and the 3rd-order intercept point. The devices operate from a +1.6V to +3.3V single supply. The MAX2667 is optimized for low current. The MAX2669 is optimized for high linearity. The shutdown feature in the device reduces the supply current to be less than 10μA. The devices are available in a very small, lead-free, RoHS-compliant, 0.86mm x 1.26mm x 0.65mm wafer-level package (WLP). Applications Automotive Navigation Location-Enabled Mobile Devices Telematics (Asset Tracking and Management) Personal Navigation Devices (PNDs) Cellular Phones with GPS Notebook PCs/Ultra-Mobile PCs Recreational, Marine Navigation Avionics Watches Features S 19dB High-Power Gain (MAX2667) S Ultra-Low Noise Figure: 0.65dB S Integrated 50Ω Output Matching Circuit S Low 4.1mA Supply Current (MAX2667) S Wide 1.6V to 3.3V Supply Voltage Range S Low Bill of Materials: Two Inductors, Three Capacitors, and One Resistor S Small Footprint: 0.86mm x 1.26mm S Thin Profile: 0.65mm S 0.4mm-Pitch Wafer-Level Package (WLP) Ordering Information PART TEMP RANGE PIN-PACKAGE MAX2667EWT+T -40°C to +85°C 6 WLP MAX2669EWT+T -40°C to +85°C 6 WLP +Denotes a lead(Pb)-free/RoHS-compliant package. T = Tape and reel. Typical Application Circuit RF INPUT C3 BIAS L2 C1 L1 + A1 RFIN B1 MAX2667 MAX2669 BIAS A2 RFOUT 25kΩ SHDN RF OUTPUT B2 VCC VCC C2 GNDAC C1 C2 GNDDC L2 = 100nH C3 = 39pF L1 = 6.2nH (MAX2667) C1 = 100nF (MAX2667) C2 = 39pF L1 = 3.3nH (MAX2669) C1 = 100nF (MAX2669) For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com. 19-5518; Rev 1; 9/12 MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs ABSOLUTE MAXIMUM RATINGS VCC to GND_.........................................................-0.3V to +3.6V RFOUT and BIAS to GND_...... -0.3V to (Operating VCC + 0.3V) Maximum RF Input Power................................................ +5dBm Continuous Power Dissipation (TA = +70°C) WLP (derates 10.5mW/°C above +70°C).....................840mW Maximum Current into RF Input..........................................10mA Operating Temperature Range........................... -40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range............................. -65°C to +160°C Soldering Temperature (reflow) (Note 1).........................+260°C Note 1: Refer to Application Note 1891: Wafer-level packaging (WLP) and its applications. CAUTION! ESD SENSITIVE DEVICE Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 2) Junction-to-Ambient Thermal Resistance (qJA)...........95°C/W Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. DC ELECTRICAL CHARACTERISTICS (MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, no RF signals are applied, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and TA = +25°C, unless otherwise noted.) (Note 2) PARAMETER Supply Voltage Supply Current Digital Input Logic-High Digital Input Logic-Low CONDITIONS SHDN = high MAX2667 MAX2669 Shutdown mode, SHDN = low TA = +25°C TA = +25°C MIN TYP MAX UNITS 1.6 2.85 3.3 V 4.1 7.7 mA 10 FA 1.2 V 0.45 V AC ELECTRICAL CHARACTERISTICS (MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and TA = +25°C, unless otherwise noted.) (Note 2) PARAMETER RF Frequency Power Gain Noise Figure L1 band VCC = 2.85V VCC = 1.6V CONDITIONS MAX2667 MAX2669 MAX2667 MAX2669 VCC = 1.8V VCC = 3.3V MIN 15.0 14.6 14.8 14.3 TYP 1575.42 19.5 17.7 19.4 17.6 0.65 0.65 MAX UNITS MHz dB dB 2   Maxim Integrated MAX2667/MAX2669 GPS/GNSS Ultra-Low-Noise-Figure LNAs AC ELECTRICAL CHARACTERISTICS (continued) (MAX2667/MAX2669 EV kit. VCC = 1.6V to 3.3V, fRFIN = 1575.42MHz, TA = -40°C to +85°C. Typical values are at VCC = 2.85V and TA = +25°C, unless otherwise noted.) (Note 2) PARAMETER In-Band 3rd-Order Input Intercept Point Out-of-Band 3rd-Order Input Intercept Point Input 1dB Compression Point Input R.


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