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NCP5338 Dataheets PDF



Part Number NCP5338
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Integrated Driver and MOSFET
Datasheet NCP5338 DatasheetNCP5338 Datasheet (PDF)

NCP5338 Integrated Driver and MOSFET The NCP5338 integrates a MOSFET driver, high−side MOSFET and low−side MOSFET into a 6 mm x 6 mm 40−pin QFN package. The driver and MOSFETs have been optimized for high−current DC−DC buck power conversion applications. The NCP5338 integrated solution greatly reduces package parasitics and board space compared to a discrete component solution. Features • Optimized for High Frequency, High Conversion Ratio Operation • Capable of Switching Frequencies Up to 1.5 .

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NCP5338 Integrated Driver and MOSFET The NCP5338 integrates a MOSFET driver, high−side MOSFET and low−side MOSFET into a 6 mm x 6 mm 40−pin QFN package. The driver and MOSFETs have been optimized for high−current DC−DC buck power conversion applications. The NCP5338 integrated solution greatly reduces package parasitics and board space compared to a discrete component solution. Features • Optimized for High Frequency, High Conversion Ratio Operation • Capable of Switching Frequencies Up to 1.5 MHz • Internal Bootstrap Diode • Zero Current Detection • Undervoltage Lockout • Internal Thermal Warning / Thermal Shutdown • 40 A Continuous Output Current Capability • These are Pb−Free Devices 5 V 12−20 V 5V ZCD Enable Output Disable PWM Thermal Warning THWN VIN VCIN BOOT ZCD_EN# DISB# PWM CGND PHASE VSWH PGND Vout http://onsemi.com 1 40 QFN40 MN SUFFIX CASE 485AZ MARKING DIAGRAM 1 NCP5338 AWLYYWWG A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping† NCP5338MNR2G QFN40 2500/Tape & Reel (Pb−Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Figure 1. Application Schematic © Semiconductor Components Industries, LLC, 2014 January, 2014 − Rev. 2 1 Publication Order Number: NCP5338/D VCIN PWM ZCD_EN# 3.4 V 97k 187k DISB# NCP5338 BOOT GH VIN Logic Anti−Cross Conduction VCIN UVLO THWN/THDN PHASE VSWH PGND THWN Figure 2. Simplified Block Diagram GL 10 VIN 9 VIN 8 VIN 7 PHASE 6 GH 5 CGND 4 BOOT 3 NC 2 VCIN 1 ZCD_EN# VIN VIN VIN VIN VSWH PGND PGND PGND PGND PGND 11 12 13 14 15 16 17 18 19 20 VIN FLAG42 CGND FLAG41 VSWH FLAG43 40 PWM 39 DISB# 38 THWN 37 CGND 36 GL 35 VSWH 34 VSWH 33 VSWH 32 VSWH 31 VSWH PGND 21 PGND 22 PGND 23 PGND 24 PGND 25 PGND 26 PGND 27 PGND 28 VSWH 29 VSWH 30 Figure 3. Pin Connections (Top View) http://onsemi.com 2 NCP5338 Table 1. PIN FUNCTION DESCRIPTION Pin No. Pin Name Description 1 ZCD_EN# Enable Zero Current Detection 2 VCIN Control Input Voltage 3 NC No Connect 4 BOOT Bootstrap Voltage 5, 37, FLAG 41 CGND Control Signal Ground 6 GH High Side FET Gate Access 7 PHASE Provides a return path for the high side driver of the internal IC. Place a high frequency ceramic capacitor of 0.1 uF to 1.0 uF from this pin to BOOT pin. 8−14, FLAG 42 VIN Input Voltage 15, 29−35, FLAG 43 VSWH Switch Node Output 16−28 PGND Power Ground 36 GL Low Side FET Gate Access 38 THWN Thermal Warning 39 DISB# Output Disable Pin 40 PWM PWM Drive Logic Table 2. ABSOLUTE MAXIMUM RATINGS Symbol Parameter Min Max VCIN Control Input Voltage −0.3 V 6.5 V VIN BOOT Power Input Voltage (Note 1) Bootstrap Voltage −0.3 V −0.3 V wrt/VSWH 28 V 35 V wrt/PGND, 40 V < 50 ns wrt/PGND, 6.5 V wrt/VSWH VSWH ZCD_EN# Switch Node Output (Note 1) Zero Current Detection −0.3 V −0.3 V 30 V 6.5 V PWM PWM Drive Logic −0.3 V 6.5 V DISB# Output Disable −0.3 V 6.5 V THWN Thermal Warning −0.3 V 6.5 V Continuous Output Current, IOUT VOIuNtp=u1t 2CuVr,rVenOtU, TFS=W1.=2 300 kHz, V (Note 2) − 40 A Continuous Output Current, IOUT Output Current, FSW = 300 kHz, VIN = 12 V, VOUT = 1.2 V, LFM = 300 (Note 2) − 50 A Peak Output Current, Output Current, FSW = 300 kHz, Iout−Pk (Note 3) VIN = 12 V, VOUT = 1.2 V (Note 2) − 80 A Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. During switching of the MOSFETs, high transient voltages can appear on these pins. It is important to keep these transients within the Maximum Ratings range. 2. IOUT rating is based on using 3.0″ x 3.0″ PCB, 6 layer, 2 oz, TA = 25°C, board design, natural convection, unless otherwise noted. 3. Peak Output Current is applied for tp = 10 ms. NOTE: This device is ESD sensitive. Use standard ESD precautions when handling. Table 3. OPERATING RANGES Rating Symbol Min Typ Max Unit Control Input Voltage VCIN 4.5 5 5.5 V Input Voltage VIN 4.5 12 20 V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. http://onsemi.com 3 NCP5338 Table 4. THERMAL CHARACTERISTICS Rating Thermal Resistance, High−Side FET (Note 4) Thermal Resistance, Low−Side FET (Note 4) Operating Junction Temperature Storage Temperature Moisture Sensitivity Level 4. When mounted on 1 in2 of Cu., 1 oz. Thickness. Symbol RQJPCB RQJPCB TJ TS MSL Value 11.7 2.8 −40 to 150 −55 to 150 3 Unit °C/W °C/W °C °C ELECTRICAL CHARACTERISTICS (Note 5) (VCIN = 5 V, VIN = 12 V, TA = −10°C to +100°C, unless otherwise noted) Parameter Symbol Condition Min Typ Max Unit SUPPLY CURRENT VCIN Curr.


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