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BC51PAS; BC52PAS; BC53PAS
45 V/60 V/80 V, 1 A PNP medium power transistors
Rev. 1 — 19 June 2015
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor series encapsulated in an ultra thin DFN2020D-3 (SOT1061D) leadless small Surface-Mounted Device (SMD) plastic package with medium power capability and visible and solderable side pads.
Table 1. Product overview
Type number[1]
Package
BC51PAS
DFN2020D-3
BC52PAS
BC53PAS
SOT1061D
NPN complement BC54PAS BC55PAS BC56PAS
[1] Valid for all available selection groups.
1.2 Features and benefits
High collector current capability
Three current gain selections
IC and ICM Reduced Printed-Circuit Board (PCB) Leadless very small SMD plastic
area requirements
package with medium power capability
Exposed heat sink for excellent thermal Suitable for Automatic Optical
and electrical conductivity
Inspection (AOI) of solder joint
AEC-Q101 qualified
1.3 Applications
Linear voltage regulators Battery driven devices MOSFET drivers
High-side switches Power management Amplifiers
1.4 Quick reference data
Table 2. Quick reference data Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
VCEO
collector-emitter voltage open base BC51PAS series
BC52PAS series
BC53PAS series
Min Typ Max Unit
- - 45 V - - 60 V - - 80 V
NXP Semiconductors
BC51PAS; BC52PAS; BC53PAS
45 V/60 V/80 V, 1 A PNP medium power transistors
Table 2. Quick reference data …continued Tamb = 25 C unless otherwise specified
Symbol Parameter
Conditions
IC collector current
ICM peak collector current single pulse; tp 1 ms
hFE DC current gain
VCE = 2 V; IC = 150 mA
hFE selection -10
VCE = 2 V; IC = 150 mA
hFE selection -16
VCE = 2 V; IC = 150 mA
[1] Pulse test: tp 300 ms; 0.02.
2. Pinning information
Min Typ Max Unit
- - 1 A
- - 2 A
[1] 63 -
250
[1] 63 -
160
[1] 100 -
250
Table 3. Pin 1 2 3
Pinning Description base emitter collector
Simplified outline Graphic symbol
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3. Ordering information
Table 4. Ordering information
Type number[1] Package
Name
Description
BC51PAS series BC52PAS series BC53PAS series
DFN2020D-3
plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 2 0.65 mm.
[1] Valid for all available selection groups.
Version SOT1061D
BC51_52_53PAS_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
2 of 15
NXP Semiconductors
BC51PAS; BC52PAS; BC53PAS
45 V/60 V/80 V, 1 A PNP medium power transistors
4. Marking
Table 5. Marking codes Type number BC51PAS BC51-10PAS BC51-16PAS BC52PAS BC52-10PAS BC52-16PAS BC53PAS BC53-10PAS BC53-16PAS
Marking code C4 C5 C6 C7 C8 C9 CA CB CC
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VCBO
collector-base voltage BC51PAS series
open emitter
-
BC52PAS series
-
BC53PAS series
-
VCEO
collector-emitter voltage open base BC51PAS series
-
BC52PAS series
-
BC53PAS series
-
VEBO IC ICM IB
emitter-base voltage collector current peak collector current base current
open collector single pulse; tp 1 ms
-
Max
45 60 100
45 60 80 5 1 2 0.3
Unit
V V V
V V V V A A A
BC51_52_53PAS_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 19 June 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
3 of 15
NXP Semiconductors
BC51PAS; BC52PAS; BC53PAS
45 V/60 V/80 V, 1 A PNP medium power transistors
Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Ptot total power dissipation Tamb 25 C
[1] [2] -
[3] -
[4] -
[5] -
Tj Tamb Tstg
junction temperature ambient temperature storage temperature
55 65
Max Unit 0.42 W 0.81 W 0.83 W 1.10 W 1.65 W 150 C 150 C 150 C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 1 cm2. [4] Device mounted on an FR4 PCB, single-sided copper, tin-plated and mounting pad for collector 6 cm2. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and mounting pad for collector 1 cm2.
3WRW :
DDF
(1) FR4 PCB, 4-layer copper, 1 cm2 (2) FR4 PCB, single-sided copper, 6 cm2 (3) FR4 PCB, single-sided copper, 1 cm2 (4) FR4 PCB, 4-layer copper, standard footprint (5) FR4 PCB, single-sided copper, standard footprint
Fig 1. Power derating curves
7DPE&
BC51_52_53PAS_SER
Product data sheet
All informa.