Document
SPECIFICATION
Device Name Type Name
: IGBT Module
(RoHS compliant product)
: 2MBI225U4J-120-50
Spec. No. : MS5F 6856
May 24 ’07 H.Kaneda May 24 ’07 S.Miyashita T.Miyasaka
K.Yamada
MS5F6856
1a 15
H04-004-07b
Revised Records
Date
Classification
Ind.
May-24-’07 Enactment
Content
Applied date
Drawn Checked Checked Approved
Issued date
S.Miyashita K.Yamada T.Miyasaka
Oct.-12 -’07 Revision
a Revised characteristics
VCE(sat) typ.(P4/15)
S.Yoshiwatari S.Miyashita J.Komatsu T.Miyasaka
MS5F6856
a
2 15
H04-004-06b
2MBI225U4J-120-50 (RoHS compliant product)
1. Outline Drawing ( Unit : mm )
2. Equivalent circuit
GND
[Inverter] +
G1.1
G 1.2 EX 1.2
[Thermistor]
CX 1 G 1.3
T1 T2
Cu-Base
G2.1
G 2.2 EX 2.2
G 2.3
-
Note : GND terminal current rating DC 1A max.
MS5F6856
a
3 15
H04-004-03a
3. Absolute Maximum Ratings ( at Tc= 25oC unless otherwise specified )
It em s
Sym b o l s
Conditions
Max i m u m Ratings
Units
Collector-Emitter voltage
VCES
1200
V
Gate-Emitter voltage
VGES
±20 V
Ic
Continuous
Tc=25oC Tc=80oC
300 225
Collector current
Icp
1ms
Tc=25oC Tc=80oC
600 450
A
-Ic 225
-Ic pulse
1ms
450
Collector Power Dissipation
Pc 1 device
1040
W
Junction temperature Storage temperature
Tj Tstg
+150 -40 to +125
oC
Isolation between terminal and copper base (*1) voltage between thermistor and others (*2)
Viso
AC : 1min.
2500
VAC
Screw Torque
Mounting (*3) Terminals (*4) PC-Board (*5)
-
3.5 4.5 N m 0.6
(*1) All terminals should be connected together when isolation test will be done.
(*2) Two thermistor terminals should be connected together, each other terminals should be connected together
and shorted to base plate when isolation test will be done.
(*3) Recommendable Value : Mounting 2.5 to 3.5 Nm (M5)
(*4) Recommendable Value : Terminals 3.5 to 4.5 Nm (M6)
(*5) Recommendable Value : PC-Board 0.4 to 0.6 Nm (M2.5)
4. Electrical characteristics ( at Tj= 25oC unless otherwise specified )
It em s
Sym b o l s
Conditions
Characteristics min. typ. max.
Zero gate voltage collector current
ICES
VCE=1200V VGE=0V
- - 3.0
Gate-Emitter leakage current
IGES
VCE=0V VGE=±20V
- - 600
Gate-Emitter threshold voltage
VGE(th)
VCE=20V Ic=225mA
4.5 6.5 8.5
VCE(sat) Ic=225A
Tj=25oC
- a 2.25
2.40
Collector-Emitter
(terminal) VGE=15V
Tj=125oC - a 2.45
-
saturation voltage
VCE(sat)
Tj=25oC
-
1.90 2.05
(chip)
Tj=125oC
-
2.10
-
Inverter
Input capacitance
Cies
VCE=10V,VGE=0V,f=1MHz -
25
-
ton Vcc=600V
- 0.32 1.20
Turn-on time
tr Ic=225A
- 0.10 0.60
tr(i) VGE=±15V
- 0.03
-
Turn-off time
toff RG=3.0Ω tf
- 0.41 1.00 - 0.07 0.30
VF
IF=225A
Tj=25oC
-
1.90 2.05
Forward on voltage
(terminal) VF
VGE=0V
Tj=125oC Tj=25oC
-
2.00 1.65 1.80
(chip)
Tj=125oC
-
1.75
-
Reverse recovery time
trr
IF=225A
- - 0.35
Lead resistance, terminal-chip (*6)
R lead
- 1.30
-
Thermistor
Resistance
R
T=25oC T=100oC
- 5000 465 495
520
B value
B T=25/50oC
3305
3375
3450
(*6) Biggest internal terminal resistance among arm.
Units mA nA V
V nF
us
V us mΩ Ω K
5. Thermal resistance characteristics
It em s
Sym b o l s
Conditions
Characteristics min. typ. max.
Thermal resistance(1device) Rth(j-c)
IGBT FWD
- - 0.12 - - 0.20
Contact Thermal resistance (1 device) (*7)
Rth(c-f)
with Thermal Compound
- 0.0167 -
(*7) This is the value which is defined mounting on the additional cooling fin with thermal compound.
Units oC/W
MS5F6856
a
4 15
H04-004-03a
6.Indication on module
Display on the module label - Logo of production - Type name : 2MBI225U4J-120-50 - IC, VCES rating 225A 1200V - Lot No. (5 digits) - Place of manufacturing (code) - Bar code
7.Recommend way of mounting on Heat sink (1) Initial : 1/3 specified torque, sequence (1)→(2)→(3)→(4) (2) Final :Full specified torque (3.5 Nm),sequence(4)→(3)→(2)→(1)
(3) (1) (2) (4)
Mounting holes Heat sink
Module
8.Recommend way of PCB mounting on the Module (1) Initial : 1/3 specified torque, sequence (1)→(2)→(3)→(4)→(5)
(2) Final :Full specified torque (0.6 Nm),sequence(1)→(2)→(3)→(4)→(5)
(4) (2)
(1) (3) (5)
Mounting holes PCB (Printed Circuit Board)
Module
M2.4 - M2.6 self tapping screw or M2.5 metrical screw is recommended. The screw length to be PCB thickness +8mm or less. Recommended tightening torque is 0.4 to 0.6 N m.
Note: FR4 is suitable as PCB material. Nickel with a gold flash(Ni+Au) is recommended as surface metallization for spring landing pads. Tin(Sn) can also be used.
9. Applicable category This specification is applied to IGBT-Module named 2MBI225U4J-120-50.
MS5F6856
a
5 15
H04-004-03a
10. Storage and transportation notes • The module should be stored at a standard temperature of 5 to 35oC and humidity of 45 to 75% .
• Store modules in a place with few temperature changes in order to avoid condensation on the module surface.
• Avoid exposure to corrosive gases and dust.
• Avoid excessive external force on the module.
• Store modules with unprocessed t.