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2MBI225U4J-120-50 Dataheets PDF



Part Number 2MBI225U4J-120-50
Manufacturers Fuji Electric
Logo Fuji Electric
Description IGBT
Datasheet 2MBI225U4J-120-50 Datasheet2MBI225U4J-120-50 Datasheet (PDF)

SPECIFICATION Device Name Type Name : IGBT Module (RoHS compliant product) : 2MBI225U4J-120-50 Spec. No. : MS5F 6856 May 24 ’07 H.Kaneda May 24 ’07 S.Miyashita T.Miyasaka K.Yamada MS5F6856 1a 15 H04-004-07b Revised Records Date Classification Ind. May-24-’07 Enactment Content Applied date Drawn Checked Checked Approved Issued date S.Miyashita K.Yamada T.Miyasaka Oct.-12 -’07 Revision a Revised characteristics VCE(sat) typ.(P4/15) S.Yoshiwatari S.Miyashita J.Komatsu T.Miyasaka .

  2MBI225U4J-120-50   2MBI225U4J-120-50


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SPECIFICATION Device Name Type Name : IGBT Module (RoHS compliant product) : 2MBI225U4J-120-50 Spec. No. : MS5F 6856 May 24 ’07 H.Kaneda May 24 ’07 S.Miyashita T.Miyasaka K.Yamada MS5F6856 1a 15 H04-004-07b Revised Records Date Classification Ind. May-24-’07 Enactment Content Applied date Drawn Checked Checked Approved Issued date S.Miyashita K.Yamada T.Miyasaka Oct.-12 -’07 Revision a Revised characteristics VCE(sat) typ.(P4/15) S.Yoshiwatari S.Miyashita J.Komatsu T.Miyasaka MS5F6856 a 2 15 H04-004-06b 2MBI225U4J-120-50 (RoHS compliant product) 1. Outline Drawing ( Unit : mm ) 2. Equivalent circuit GND [Inverter] + G1.1 G 1.2 EX 1.2 [Thermistor] CX 1 G 1.3 T1 T2 Cu-Base G2.1 G 2.2 EX 2.2 G 2.3 - Note : GND terminal current rating DC 1A max. MS5F6856 a 3 15 H04-004-03a 3. Absolute Maximum Ratings ( at Tc= 25oC unless otherwise specified ) It em s Sym b o l s Conditions Max i m u m Ratings Units Collector-Emitter voltage VCES 1200 V Gate-Emitter voltage VGES ±20 V Ic Continuous Tc=25oC Tc=80oC 300 225 Collector current Icp 1ms Tc=25oC Tc=80oC 600 450 A -Ic 225 -Ic pulse 1ms 450 Collector Power Dissipation Pc 1 device 1040 W Junction temperature Storage temperature Tj Tstg +150 -40 to +125 oC Isolation between terminal and copper base (*1) voltage between thermistor and others (*2) Viso AC : 1min. 2500 VAC Screw Torque Mounting (*3) Terminals (*4) PC-Board (*5) - 3.5 4.5 N m 0.6 (*1) All terminals should be connected together when isolation test will be done. (*2) Two thermistor terminals should be connected together, each other terminals should be connected together and shorted to base plate when isolation test will be done. (*3) Recommendable Value : Mounting 2.5 to 3.5 Nm (M5) (*4) Recommendable Value : Terminals 3.5 to 4.5 Nm (M6) (*5) Recommendable Value : PC-Board 0.4 to 0.6 Nm (M2.5) 4. Electrical characteristics ( at Tj= 25oC unless otherwise specified ) It em s Sym b o l s Conditions Characteristics min. typ. max. Zero gate voltage collector current ICES VCE=1200V VGE=0V - - 3.0 Gate-Emitter leakage current IGES VCE=0V VGE=±20V - - 600 Gate-Emitter threshold voltage VGE(th) VCE=20V Ic=225mA 4.5 6.5 8.5 VCE(sat) Ic=225A Tj=25oC - a 2.25 2.40 Collector-Emitter (terminal) VGE=15V Tj=125oC - a 2.45 - saturation voltage VCE(sat) Tj=25oC - 1.90 2.05 (chip) Tj=125oC - 2.10 - Inverter Input capacitance Cies VCE=10V,VGE=0V,f=1MHz - 25 - ton Vcc=600V - 0.32 1.20 Turn-on time tr Ic=225A - 0.10 0.60 tr(i) VGE=±15V - 0.03 - Turn-off time toff RG=3.0Ω tf - 0.41 1.00 - 0.07 0.30 VF IF=225A Tj=25oC - 1.90 2.05 Forward on voltage (terminal) VF VGE=0V Tj=125oC Tj=25oC - 2.00 1.65 1.80 (chip) Tj=125oC - 1.75 - Reverse recovery time trr IF=225A - - 0.35 Lead resistance, terminal-chip (*6) R lead - 1.30 - Thermistor Resistance R T=25oC T=100oC - 5000 465 495 520 B value B T=25/50oC 3305 3375 3450 (*6) Biggest internal terminal resistance among arm. Units mA nA V V nF us V us mΩ Ω K 5. Thermal resistance characteristics It em s Sym b o l s Conditions Characteristics min. typ. max. Thermal resistance(1device) Rth(j-c) IGBT FWD - - 0.12 - - 0.20 Contact Thermal resistance (1 device) (*7) Rth(c-f) with Thermal Compound - 0.0167 - (*7) This is the value which is defined mounting on the additional cooling fin with thermal compound. Units oC/W MS5F6856 a 4 15 H04-004-03a 6.Indication on module Display on the module label - Logo of production - Type name : 2MBI225U4J-120-50 - IC, VCES rating 225A 1200V - Lot No. (5 digits) - Place of manufacturing (code) - Bar code 7.Recommend way of mounting on Heat sink (1) Initial : 1/3 specified torque, sequence (1)→(2)→(3)→(4) (2) Final :Full specified torque (3.5 Nm),sequence(4)→(3)→(2)→(1) (3) (1) (2) (4) Mounting holes Heat sink Module 8.Recommend way of PCB mounting on the Module (1) Initial : 1/3 specified torque, sequence (1)→(2)→(3)→(4)→(5) (2) Final :Full specified torque (0.6 Nm),sequence(1)→(2)→(3)→(4)→(5) (4) (2) (1) (3) (5) Mounting holes PCB (Printed Circuit Board) Module M2.4 - M2.6 self tapping screw or M2.5 metrical screw is recommended. The screw length to be PCB thickness +8mm or less. Recommended tightening torque is 0.4 to 0.6 N m. Note: FR4 is suitable as PCB material. Nickel with a gold flash(Ni+Au) is recommended as surface metallization for spring landing pads. Tin(Sn) can also be used. 9. Applicable category This specification is applied to IGBT-Module named 2MBI225U4J-120-50. MS5F6856 a 5 15 H04-004-03a 10. Storage and transportation notes • The module should be stored at a standard temperature of 5 to 35oC and humidity of 45 to 75% . • Store modules in a place with few temperature changes in order to avoid condensation on the module surface. • Avoid exposure to corrosive gases and dust. • Avoid excessive external force on the module. • Store modules with unprocessed t.


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