Document
CYStech Electronics Corp.
Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2014.09.24 Page No. : 1/ 6
3.0Amp. Surface Mount Schottky Barrier Diodes
SK320SC-SK3150SC Series
Features
For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Low leakage current High surge capability High temperature soldering: 250C/10 seconds at terminals Exceeds environmental standards of MIL-S-19500/228
Mechanical Data
Case: Molded plastic, SMC/JEDEC DO-214AB. Terminals: Solder plated, solderable per MIL-STD-750 method 2026 Polarity: Indicated by cathode band. Mounting Position : Any. Weight: 0.195 gram, 0.00585 ounce
Ordering Information
Device
SK320SC- 0-T6-G SK340SC- 0-T6-G SK360SC- 0 -T6-G SK3100SC-0-T6-G SK3150SC-0-T6-G
Package
SMC (Pb-free lead plating and halogen-free
package)
Shipping 3000 pcs / Tape & Reel
Marking SK32 SK33 SK34 S310 S315
Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products
Packing spec, T6 : 3000 pcs / tape & reel, 13” reel Product rank, zero for no rank products
Product name
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2014.09.24 Page No. : 2/ 6
Maximum Ratings and Electrical Characteristics
(Rating at 25C ambient temperature unless otherwise specified. )
Parameter
Type Symbol SK320 SK340 SK360 SK3100 SK3150 Units
Repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage
Maximum instantaneous forward voltage, IF=3A Average forward rectified current
Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) Maximum DC reverse current VR=VRRM,TA=25℃ VR=VRRM,TA=125℃ Maximum thermal resistance, Junction to ambient Maximum thermal resistance, Junction to lead Diode junction capacitance @ f=1MHz and applied 4VDC reverse voltage
Storage temperature
Operating temperature
VRRM 20 40 60 100 150 V VRMS 14 28 42 70 105 V
VR 20 40 60 100 150 V
VF 0.50 0.50 0.7 0.85 0.9 V
IO 3 A
IFSM 80 A
IR
Rth,JA Rth,JL
CJ Tstg TJ
0.5 50
55 17 (Note)
250(typ)
-55 ~ +150
-55 ~ +125
-55 ~ +150
mA mA
℃/W
pF ℃ ℃
Note : Measure on PCB with 0.2”×0.2”(5mm×5mm) copper pad area.
Recommended soldering footprint
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2014.09.24 Page No. : 3/ 6
Peak For w ar d Su rg e Cur r en t- - - I FSM( A )
Characteristic Curves
Average Forward Current---Io(A)
3.5 3
2.5 2
1.5 1
0.5 0 0
Forward Current Derating Curve
SK360-3150
SK320-340
50 100 150 Ambient Temperature---TA(℃)
Forward Current vs Forward Voltage
100
SK320-340
10 SK360
200
1 SK3100-3150
0.1 Tj=25℃, Pulse width=300μs,
1% Duty cycle
0.01 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 Forward Voltage---VF(V)
Junction Capacitance---CJ(pF)
Maximum Non-Repetitive Forward Surge Cur
90
80 T j = 2 5 ℃ , 8 . 3 m s S i n g l e H a l f 70 S i n e W a v e
JEDEC method 60
50
40
30
20
10
0 1 10 100 Number of Cycles at 60Hz
Junction Capacitance vs Reverse Voltage
700 600
500 400
300 200
100
0 0.01
0.1 1 10 Reverse Voltage---VR(V)
100
Forward Current---IF(A)
Reverse Leakage Current vs Reverse Voltage 100
Reverse Leakage Current---IR(m A)
10
1 Tj=75℃
0.1 Tj=25℃
0.01 0
20 40 60 80 100 120 140
Percent of Rated Peak Reverse Voltage---(%)
SK320SC-SK3150SC
CYStek Product Specification
Reel Dimension
CYStech Electronics Corp.
Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2014.09.24 Page No. : 4/ 6
Carrier Tape Dimension
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
Recommended temperature profile for IR reflow
Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2014.09.24 Page No. : 5/ 6
Profile feature Average ramp-up rate
(Tsmax to Tp)
Sn-Pb eutectic Assembly 3C/second max.
Pb-free Assembly 3C/second max.
Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max)
Time maintained above: −Temperature (TL) − Time (tL)
Peak Temperature(TP)
Time within 5C of actual peak temperature(tp)
Ramp down rate
Time 25 C to peak temperature
100C 150C 60-120 seconds
183C 60-150 seconds 240 +0/-5 C
10-30 seconds
6C/second max.
6 minutes max.
150C 200C 60-180 seconds
217C 60-150 seconds 260 +0/-5 C
20-40 seconds
6C/second max.
8 minutes max.
Note : All temperatures refer to topside of the package, measured on the package body surface.
SK320SC-SK3150SC
CYStek Product Specification
CYStech Electronics Corp.
DO-214AB/SMC Dimension
Spec. No. : C333SC Issued Date : 2011.01.07 Revised Date :2014.09.24 Page No. : 6/ 6
DO-214AB/SMC Plastic Surface Mounted Package CYStek Package Code : SC
DIM
Inches Min. Max.
A 0.110 0.126
B 0.220 0.245
C 0.260 0.283
D 0.078 0.103
Mi.