IR15-21C-L10

A-BRIGHT A-BRIGHT INDUSTRIAL CO., LTD. SURFACE MOUNT CHIP LED LAMPS 1206 Package Chip Infrared LED Part Number: IR15-21C/L10 Package outlines & Re-flow Profile „Reflow Temp/Time For Reflow Soldering „Soldering iron Basic spec is U 5sec when 260℃. If temperature is higher, time should be shorter (+10℃Æ -1sec ).Power dissipation of iron should be smaller than 15W, and temperatures should be controllable .Surface temperature of the device should be under 230℃ . ITEM Resin (mold) Lens color Printed circuit board Dice Emitted color MATERIALS Epoxy Water Clear BT GaAlAs Infrared NOTES: 1. All dimensions are in millimeters (inches); 2. Tolerances are ±0.1mm (0.004inch) unless otherwise noted. 2006/9/28 A-BRIGHT A-BRIGHT INDUSTRIAL CO., LTD. SURFACE MOUNT CHIP LED LAMPS Part Number: IR15-21C/L10 ELECTRO-OPTICAL CHARACTERISTICS (TA=25℃) Parameter Test Condition Symbol Value Unit Viewing angle at 50% IV Forward voltage Radiant Intensity Wavelength Spectral Line Half-Width IF=10mA 2θ1/2 160 Deg (Typ.) 1.20 IF=20mA VF V (Max.) 1.50 (Min.) 0.20 IF=20mA IV mW/sr (Typ.) 0.80 IF=20mA λp 940 nm IF=20mA △λ 45 nm Peak pulsing current (1/10 duty f=1kHz) Absolute maximum ratings Parameter Symbol IFP 1.0 A (TA=25℃) Value Unit Forward current IF 65 mA Reverse voltage VR 5 V Reverse current Power Dissipation IR 100 µA PD 130 mW Operating temperature range Top -25 ~+85 ℃ Storage temperature range Tstg -40 ~+100 ℃ Lead soldering temperature ...