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NCP5080 Dataheets PDF



Part Number NCP5080
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Xenon Photoflash Capacitor Charge
Datasheet NCP5080 DatasheetNCP5080 Datasheet (PDF)

NCP5080 Xenon Photoflash Capacitor Charge with Photo Sense Interface The NCP5080 product is a high voltage boost driver dedicated to the Xenon power flashes. The built-in DC/DC converter is based on a flyback structure with an external transformer to adapt any range of high voltage demand. The external feedback network makes it possible to dynamically adjust of the output voltage. Features •ă2.7 V to 5.5 V Input Voltage Range •ăXenon Function Fully Supported •ăBuilt-in Short Circuit Protection.

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NCP5080 Xenon Photoflash Capacitor Charge with Photo Sense Interface The NCP5080 product is a high voltage boost driver dedicated to the Xenon power flashes. The built-in DC/DC converter is based on a flyback structure with an external transformer to adapt any range of high voltage demand. The external feedback network makes it possible to dynamically adjust of the output voltage. Features •ă2.7 V to 5.5 V Input Voltage Range •ăXenon Function Fully Supported •ăBuilt-in Short Circuit Protection •ăDedicated Photo Flash Trigger Pin •ăProvides IGBT drive •ăEmbedded Photodiode Sense •ăAdjustable Primary Ipeak Current •ăThis is a Pb-Free Device Typical Applications •ăDigital Camera Photo Flash •ăDigital Cellular Phone Camera Photo Flash •ăLow Power Beacon http://onsemi.com MARKING DIAGRAM 1 LLGA12 CASE 513AD XXXXX XXXXX ALYWG G A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb-Free Package (Note: Microdot may be in either location) PHREF 1 TRGFL 2 IGBT 3 VBAT 4 PGND 5 VSW 6 12 PHSEN 11 VHB 10 IPKRF 9 AGND 8 READY 7 EN ORDERING INFORMATION Device Package Shipping† +VBAT GND +VBAT R6 D6 1k READY S2 EN ENABLE S1 TRGFL TRIGGER 12 XENON TUBE 11k R5 NCP5080MUTXG LLGA12 3000 / Tape & Reel (Pb-Free) †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. GND +VBAT C2 10mF/6.3V GND U1 READY8 READY VBAT 4 2 T1 4 C3 22mF/315V D1 14 BAS21-B GND 7 EN 2 TRGFL 1 PHREF 12 PHSEN 10 IPK-REF 13 GND Vsw 6 COILCRAFT-CJ5143-AL GND PGND 5 R12 IGBT 3 R7 10k VHT R3 X1 3 220k T2 FLTRG-TB-KR8 13 C4 Ns Np 47nF/400V 2 9 AGNG NCP5080 VFB 11 R1 33R R2 8G VHT GND 1 34 Collector Q1 Emitter IGBT-CY25BAH-8F GND GND 12k C1 10nF 3.0M Figure 1. Typical NCP5080 Photo Flash Application 76 5 GND ©Ă Semiconductor Components Industries, LLC, 2007 July, 2007 - Rev. 1 1 Publication Order Number: NCP5080/D NCP5080 +VBAT VBAT 4 UVLO Thermal Shutdown Boost Driver +Vbat READY 8 EN TRGFL PHREF PHSEN IPKREF AGND 7 2 100k 1 100k 12 10 9 GND GND GND Controller 6 Vsw Q1 GND Vbat 5 PGND 3 Buffer GND 11 IGBT VFB GND Figure 2. NCP5080 Simplified Block Diagram http://onsemi.com 2 NCP5080 PIN DESCRIPTIONS PIN Name Type Description 1 PHREF INPUT, The external controller biases this pin with the reference voltage used, together with the PHSEN ANALOG pin, to control the illumination of the photo scene. The VPH voltage shall be in the 0.5 V to 1.5 V range, capable to support the internal resistor network (R load minimum is 500 kW). The photo sense function is deactivated when 0.5 V v PHREF v 1.5 V and PHSEN = GND (see Table 4). 2 TRGFL INPUT, A positive going pulse applied to this pin triggers the external IGBT and the flash sequence takes DIGITAL place. This command is active when EN = High, but is not synchronized with the output voltage value (see Table 4). 3 IGBT OUTPUT, This pin provides the signal to drive the external IGBT and can be forced High or Low independ‐ POWER ently of the output voltage value, (assuming EN = High) according to the TRGFL pin status (see Table 4). Depending upon the type of IGBT used in the application, specific external gate network might be necessary to satisfy the IGBT gate drive conditions. 4 VBAT INPUT, This pin carries the power supply to the analog, digital and DC/DC converter blocks and must be POWER decoupled to ground by a 10 mF ceramic capacitor connected as close as possible to the package. 5 PGND POWER This pin is the GROUND return for the DC/DC converter and must be connected to the system ground, a ground plane is strongly recommended. 6 VSW OUTPUT, This pin is the drain of the internal NMOS device and shall be connected to the primary of the POWER external transformer. Care must be observed, at PCB layout level, to minimize the noise due to the large current and voltage transients present on that pin during normal operation. 7 EN INPUT, This pin controls the operation of the boost converter: DIGITAL EN = Low ³ The DC/DC converter is OFF, no flash can take place, the voltage across the external reservoir capacitor depends solely upon the leakage current present in the environment. EN = High ³ The DC/DC converter is activated, the voltage across the external reservoir capacitor is regulated at the predetermined value according to the VFB reference. Similarly, a flash can take place, assuming the Xenon tube is properly biased. 8 READY OUTPUT, This Open Drain Output goes LOW when the output voltage has reached the predetermined value DIGITAL across the external reservoir capacitor. The signal is HIGH when Vout is below the expected value, or if a fault has been detected at chip level. 9 AGND POWER This pin returns the Analog and Digital blocks ground and must be connected to the external ground plane. 10 IPKREF INPUT, This pin provides the setup of the peak current flowing into the primar.


RD3CYD08 NCP5080 VLS252010


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