LDHA24N00BAA-300

!Note PPleleaasseerreeaaddrraatitninggaanndd!!CCAAUUTTIOIONN((foforrsstotorraaggee,,ooppeerraatitningg,,rraatitningg,,ssooldldeerriningg,,mmoouunntitninggaannddhhaannddlilningg))ininththisisPcDatFalcoagtatolopgrteovepnretvsemnot ksimngokaindg/oarndb/uorrnbinugr,neintgc., etc. N91E7.pdf 03.5.13 TThhisisccaatatalologghhaassoonnlylytytyppiciacal sl pspeecicficfiactaiotinosn.sTbheecraeufosree,thyeorueaisrenroeqsupeascteedfotrodaeptapirloevdesopuercpifircoadtuiocnt ss.pTehceifirceafotioren,spoleratosetranpsparocvt ethoeuarppprroodvuacl tsshpeeectifoicraptiroondsucotrstrpaencsifaiccatitohnesabpepfororevaolrsdheerientgf.or product specifications before ordering. Chip Multilayer Delay Lines Chip Multilayer Delay Lines 1 3.2±0.2 1.1±0.2 1.60±0.2 0.25+0.1/-0.15 0.5±0.1 This Delay Line was developed by applying ceramic (3) (2) (1) multilayering and hole technology. It consists of copper line and low dielectric constant material and incorporates metal shields. LDH series are very small (4) (8) (5) (6) (7) 0.25+0.1/-0.15 and made for use at high frequencies. 0.35±0.2 0.45±0.15 s Features (1)(3)(5)(7) : NC (2)(6) : GND (4)(8) : IN/OUT 1. High stability at high frequency (2GHz) 0.5±0.1 1.0±0.1 (in mm) 2. Small, thin and light, utilizing multilayer construction m3. Metal shield is built inside chip. 4. Reflow solderable o5. Supplied on tape Sheet4U.c0.6±0.1 .DataDirectional Input Mark (1) (2) (3) (8) (4) (7) (6) (5) 0.4±0.2 4.5±0.2 3.2±0.2 2.2±0.1 0.3±0.2 0.1±0.1 ...