MMSZ5242B

Surface Mount Zener Diode Features:   Planar Die Construction   500mW Power Dissipation   General Purpose, Medium Current   Ideally Suited for Automated Assembly Processes Applications:   Zener diode   Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwise specified Characteristic Symbol Value Forward voltage @ IF=10mA VF 0.9 Power dissipation Pd 500 Thermal resistance, junction to ambient air RθjA 350 Junction temperature Tj 150 Storage temperature range Tstg -65 to +150 Note : D evice mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms. Unit V mW °C/W °C °C Electrical Characteristics @ Ta = 25°C unless otherwise specified Type Number Type Code Zener Voltage Range Test Current Vz@IZT IZT Nom(V) Min(V) Max(V) mA Maximum Zener Impedance ZZT@IZT ZZK@IZK = 0.25mA Ω Maximum Reverse Leakage Current IR @VR μA V MMSZ5242B H2 12 11.4 12.6 20 30 600 1 9.1 www.element14.com www.farnell.com www.newark.com Page <1> 25/02/13 V1.0 Surface Mount Zener Diode Typical Characteristics @ Ta = 25°C unless otherwise specified Package Outline Plastic surface mounted package www.element14.com www.farnell.com www.newark.com Page <2> 25/02/13 V1.0 Surface Mount Zener Diode Soldering Footprint Dimensions : Millimetres Package Information Device MMSZ5242B-7-F Package SOD-123 Shipping 3,000/Tape & Reel Part Number Table Description Surface Mount Zener Diode Part Number MMSZ5242B...