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MSC23409CL-70DS9 Dataheets PDF



Part Number MSC23409CL-70DS9
Manufacturers OKI electronic componets
Logo OKI electronic componets
Description 4M-Word x 9-Bit DRAM MODULE
Datasheet MSC23409CL-70DS9 DatasheetMSC23409CL-70DS9 Datasheet (PDF)

E2H0093-15-90 ¡¡SemicondSucetormiconductor TMhSisCv2e3rs4i0o9nC: /SCeLp-.x1x9D95S9 MSC23409C/CL-xxDS9 4,194,304-Word ¥ 9-Bit DRAM MODULE : FAST PAGE MODE TYPE DESCRIPTION The OKI MSC23409C/CL-xxDS9 is a fully decoded 4,194,304-word ¥ 9-bit CMOS Dynamic Random Access Memory Module composed of nine 4-Mb DRAMs (4M ¥ 1) in SOJ packages mounted with nine decoupling capacitors on a 30-pin glass epoxy single-inline package. This module is generally used for memory expansion in parity applications.

  MSC23409CL-70DS9   MSC23409CL-70DS9



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E2H0093-15-90 ¡¡SemicondSucetormiconductor TMhSisCv2e3rs4i0o9nC: /SCeLp-.x1x9D95S9 MSC23409C/CL-xxDS9 4,194,304-Word ¥ 9-Bit DRAM MODULE : FAST PAGE MODE TYPE DESCRIPTION The OKI MSC23409C/CL-xxDS9 is a fully decoded 4,194,304-word ¥ 9-bit CMOS Dynamic Random Access Memory Module composed of nine 4-Mb DRAMs (4M ¥ 1) in SOJ packages mounted with nine decoupling capacitors on a 30-pin glass epoxy single-inline package. This module is generally used for memory expansion in parity applications such as workstations. The low-power version (CL) offers reduced power consumption for mobile computing applications like laptops and palmtops. FEATURES • 4-Meg ¥ 9-bit organization • 30-Pin Socket Insertable Module MSC23409C/CL-xxDS9 : Solder tab • Single 5 V supply ±10% tolerance • Access times : 60, 70, 80 ns • Input : TTL compatible • Output : TTL compatible, 3-state • Refresh : 1024 cycles/16 ms (128 ms : L-version) • CAS before RAS refresh, CAS before RAS hidden refresh, RAS-only refresh capability • Multi-bit test mode capability • Fast Page Mode capability PRODUCT FAMILY Family MSC23409C/CL-60DS9 MSC23409C/CL-70DS9 MSC23409C/CL-80DS9 Access Time (Max.) tRAC 60 ns tAA 30 ns tCAC 15 ns 70 ns 35 ns 20 ns 80 ns 40 ns 20 ns Cycle Time Power Dissipation (Min.) Operating (Max.) Standby (Max.) 110 ns 130 ns 150 ns 4950 mW 4455 mW 3960 mW 49.5 mW/ 9.9 mW (L-version) 1/13 ¡ Semiconductor MSC23409C/CL-xxDS9 PIN CONFIGURATION MSC23409C/CL-xxDS9 3.38 Tpy. *1 88.9 ±0.2 82.14 Typ. f 3.18 20.45 Max. Typ. 10.16 Typ. 6.35 2.03 Typ. 1 5.59 Typ. 2.54 ±0.1 73.66 30 1.78 Typ. 5.28 Max. 2.54 Min. 1.27 +0.1 –0.08 *1 The common size difference of the board width 12.5 mm of its height is specified as ±0.2. The value above 12.5 mm is specified as ±0.5. Pin No. 1 2 3 4 5 6 7 8 9 10 Pin Name VCC CAS DQ0 A0 A1 DQ1 A2 A3 VSS DQ2 Pin No. 11 12 13 14 15 16 17 18 19 20 Pin Name A4 A5 DQ3 A6 A7 DQ4 A8 A9 A10 DQ5 Pin No. 21 22 23 24 25 26 27 28 29 30 Pin Name WE VSS DQ6 NC DQ7 Q8 RAS CAS8 D8 VCC 2/13 ¡ Semiconductor BLOCK DIAGRAM A0 - A10 RAS0 CAS0 WE A0 - A10 RAS D CAS Q WE VCC VSS A0 - A10 RAS D CAS Q WE VCC VSS A0 - A10 RAS D CAS Q WE VCC VSS A0 - A10 RAS D CAS Q WE VCC VSS DQ0 DQ1 DQ2 DQ3 CAS8 VCC C1 VSS C9 MSC23409C/CL-xxDS9 A0 - A10 RAS D CAS Q WE VCC VSS A0 - A10 RAS D CAS Q WE VCC VSS A0 - A10 RAS D CAS Q WE VCC VSS A0 - A10 RAS D CAS Q WE VCC VSS A0 - A10 RAS D CAS Q WE VCC VSS DQ4 DQ5 DQ6 DQ7 D8 Q8 3/13 ¡ Semiconductor MSC23409C/CL-xxDS9 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings Parameter Voltage on Any Pin Relative to VSS Voltage VCC Supply Relative to VSS Short Circuit Output Current Power Dissipation Operating Temperature Storage Temperature Symbol VIN, VOUT VCC IOS PD Topr Tstg Rating –1.0 to 7.0 –1.0 to 7.0 50 9 0 to 70 –40 to 125 Unit V V mA W °C °C Note: Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. Functional operation should be restricted to the conditions as detailed .


MSC23409CL-60DS9 MSC23409CL-70DS9 MSC23409CL-80DS9


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