Document
512Mb: x16, x32 Mobile LPDDR SDRAM Features
Mobile Low-Power DDR SDRAM
MT46H32M16LF – 8 Meg x 16 x 4 banks MT46H16M32LF – 4 Meg x 32 x 4 banks MT46H16M32LG – 4 Meg x 32 x 4 banks Features
• VDD/VDDQ = 1.70–1.95V • Bidirectional data strobe per byte of data (DQS) • Internal, pipelined double data rate (DDR) architecture; two data accesses per clock cycle • Differential clock inputs (CK and CK#) • Commands entered on each positive CK edge • DQS edge-aligned with data for READs; centeraligned with data for WRITEs • 4 internal banks for concurrent operation • Data masks (DM) for masking write data; one mask per byte • Programmable burst lengths (BL): 2, 4, 8, or 16 • Concurrent auto precharge option is supported • Auto refresh and self refresh modes • 1.8V LVCMOS-compatible inputs • Temperature-compensated self refresh (TCSR) • Partial-array self refresh (PASR) • Deep power-down (DPD) • Status read register (SRR) • Selectable output drive strength (DS) • Clock stop capability • 64ms refresh, 32ms for automotive temperature Table 1: Key Timing Parameters (CL = 3)
Speed Grade -5 -54 -6 -75 Clock Rate 200 MHz 185 MHz 166 MHz 133 MHz Access Time 5.0ns 5.0ns 5.0ns 6.0ns
Options
• VDD/VDDQ – 1.8V/1.8V • Configuration – 32 Meg x 16 (8 Meg x 16 x 4 banks) – 16 Meg x 32 (4 Meg x 32 x 4 banks) • Addressing – JEDEC-standard addressing – Reduced page size1 • Plastic "green" package – 60-ball VFBGA (8mm x 9mm) 2 – 90-ball VFBGA (8mm x 13mm) 3 • Timing – cycle time – 5ns @ CL = 3 (200 MHz) – 5.4ns @ CL = 3 (185 MHz) – 6ns @ CL = 3 (166 MHz) – 7.5ns @ CL = 3 (133 MHz) • Power – Standard IDD2/IDD6 • Operating temperature range – Commercial (0˚ to +70˚C) – Industrial (–40˚C to +85˚C) – Automotive (–40˚C to +105˚C) • Design revision
Notes:
Marking
H 32M16 16M32 LF LG BF B5 -5 -54 -6 -75 None None IT AT :C
1. Contact factory for availability. 2. Only available for x16 configuration. 3. Only available for x32 configuration.
PDF: 09005aef83dd2b3e t67m_512mb_mobile_lpddr.pdf - Rev. I 01/14 EN
1
Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2009 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
512Mb: x16, x32 Mobile LPDDR SDRAM Features
Table 2: Configuration Addressing
Architecture Configuration Refresh count Row addressing Column addressing 32 Meg x 16 8 Meg x 16 x 4 banks 8K 8K A[12:0] 1K A[9:0] 16 Meg x 32 4 Meg x 32 x 4 banks 8K 8K A[12:0] 512 A[8:0] Reduced Page Size 16 Meg x 32 4 Meg x 32 x 4 banks 8K 16K A[13:0] 256 A[7:0]
Figure 1: 512Mb Mobile LPDDR Part Numbering
MT 46
Micron Technology Product Family
46 = Mobile LPDDR
H
32M16 LF BF
-6
IT
:C
Design Revision
:C = Third generation
Operating Temperature
Blank = Commercial (0°C to +70°C) IT = Industrial (–40°C to +85°C) AT = Automotive (–40°C to +105°C)
Operating Voltage
H = 1.8/1.8V
Configuration
32 Meg x 16 16 Meg x 32
Power
Blank = Standard IDD2/IDD6
Cycle Time (CL = 3) Addressing
LF = JEDEC-standard LG = Reduced page size -5 = 5ns tCK -54 = 5.4ns tCK -6 = 6ns tCK -75 = 7.5ns tCK
Package Codes
BF = 60-ball (8mm x 9mm) VFBGA, “green” B5 = 90-ball (8mm x 13mm) VFBGA, “green”
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
PDF: 09005aef83dd2b3e t67m_512mb_mobile_lpddr.pdf - Rev. I 01/14 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2009 Micron Technology, Inc. All rights reserved.
512Mb: x16, x32 Mobile LPDDR SDRAM Features
Contents
General Description ......................................................................................................................................... 8 Functional Block Diagrams ............................................................................................................................... 9 Ball Assignments ............................................................................................................................................ 11 Ball Descriptions ............................................................................................................................................ 13 Package Dimensions ....................................................................................................................................... 15 Electrical Specifications .................................................................................................................................. 17 Electrical Specifications – IDD Parameters ........................................................................................................ 20 Electrical Specifications – AC Operating Conditions ......................................................................................... 26 Output Drive Charact.