MT29C8G96MAZAPDJV-6IT

Micron Confidential and Proprietary Preliminary‡ 168-Ball NAND Flash and LPDDR PoP (TI OMAP) MCP Features NAND Flash and Mobile LPDDR 168-Ball Package-on-Package (PoP) MCP Combination Memory (TI OMAP™) MT29C4G48MAYAPAKQ-5 IT, MT29C4G48MAZAPAKQ-5 IT, MT29C4G48MAZAPAKQ-6 IT, MT29C4G96MAZAPCJG-5 IT, MT29C4G96MAZAPCJG-6 IT, MT29C8G96MAZAPDJV-5 IT, MT29C8G96MAZAPDJV-6 IT Features Micron® NAND Flash and LPDDR components RoHS-compliant, “green” package Separate NAND Flash and LPDDR interfaces Space-saving multichip package/package-on-package combination Low-voltage operation (1.70–1.95V) Industrial temperature range: –40°C to +85°C Figure 1: PoP Block Diagram NAND Flash Power NAND Flash Device NAND Flash Interface NAND Flash-Specific Features Organization Page size – x8: 2112 bytes (2048 + 64 bytes) – x16: 1056 words (1024 + 32 words) Block size: 64 pages (128K + 4K bytes) LPDRAM Power LPDRAM Device LPDRAM Interface Mobile LPDDR-Specific Features No external voltage reference required No minimum clock rate requirement 1.8V LVCMOS-compatible inputs Programmable burst lengths Partial-array self refresh (PASR) Deep power-down (DPD) mode Selectable output drive strength STATUS REGISTER READ (SRR) supported1 Notes: 1. Contact factory for remapped SRR output. 2. For physical part markings, see Part Numbering Information (page 2). PDF: 09005aef83ba4387 168ball_nand_lpddr_j42p_j4z2_j4z3_omap.pdf – Rev. F 03/10 1 ‡Products and specifications disc...