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HD74LS08 Dataheets PDF



Part Number HD74LS08
Manufacturers Hitachi Semiconductor
Logo Hitachi Semiconductor
Description Quadruple 2-input Positive AND Gates
Datasheet HD74LS08 DatasheetHD74LS08 Datasheet (PDF)

HD74LS08 Quadruple 2-Input Positive AND Gates Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation HD74LS08P DILP-14 pin PRDP0014AB-B (DP-14AV) P HD74LS08FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP HD74LS08RPEL SOP-14 pin (JEDEC) PRSP0014DE-A (FP-14DNV) RP Note: Please consult the sales office for the above package availability. REJ03D0394–0200 Rev.2.00 Feb.18.2005 Taping Abbreviation (Quantity) — EL (2,000 pcs/reel) EL.

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HD74LS08 Quadruple 2-Input Positive AND Gates Features • Ordering Information Part Name Package Type Package Code (Previous Code) Package Abbreviation HD74LS08P DILP-14 pin PRDP0014AB-B (DP-14AV) P HD74LS08FPEL SOP-14 pin (JEITA) PRSP0014DF-B (FP-14DAV) FP HD74LS08RPEL SOP-14 pin (JEDEC) PRSP0014DE-A (FP-14DNV) RP Note: Please consult the sales office for the above package availability. REJ03D0394–0200 Rev.2.00 Feb.18.2005 Taping Abbreviation (Quantity) — EL (2,000 pcs/reel) EL (2,500 pcs/reel) Pin Arrangement 1A 1 1B 2 1Y 3 2A 4 2B 5 2Y 6 GND 7 14 VCC 13 4B 12 4A 11 4Y 10 3B 9 3A 8 3Y (Top view) Rev.2.00, Feb.18.2005, page 1 of 5 HD74LS08 Circuit Schematic (1/4) Inputs A B VCC 20k 10k 8k 75 4.5k 1.5k 3k Output Y GND Absolute Maximum Ratings Item Supply voltage Symbol VCC Note Ratings 7 Input voltage VIN 7 Power dissipation PT 400 Storage temperature Tstg –65 to +150 Note: Voltage value, unless otherwise noted, are with respect to network ground terminal. Recommended Operating Conditions Item Supply voltage Output current Operating temperature Symbol VCC IOH IOL Topr Min 4.75 — — –20 Typ 5.00 — — 25 Max 5.25 –400 8 75 Unit V V mW °C Unit V µA mA °C Rev.2.00, Feb.18.2005, page 2 of 5 HD74LS08 Electrical Characteristics Item Input voltage Output voltage Symbol VIH VIL VOH VOL Input current IIH IIL II Short-circuit output current IOS Supply current ICCH ICCL Input clamp voltage VIK Note: * VCC = 5 V, Ta = 25°C min. 2.0 — 2.7 — — — — — –20 — — — typ.* — — — — — — — — — 2.4 4.4 — max. — 0.8 — 0.5 0.4 20 –0.4 0.1 –100 4.8 8.8 –1.5 Unit V V V V µA mA mA mA mA mA V (Ta = –20 to +75 °C) Condition VCC = 4.75 V, VIH = 2 V, IOH = –400 µA IOL = 8 mA IOL = 4 mA VCC = 4.75 V, VIL = 0.8 V VCC = 5.25 V, VI = 2.7 V VCC = 5.25 V, VI = 0.4 V VCC = 5.25 V, VI = 7 V VCC = 5.25 V VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA Switching Characteristics (VCC = 5 V, Ta = 25°C) Item Symbol min. typ. max. Unit Condition Propagation delay time tPLH tPHL — — 8 10 15 20 ns ns CL = 15 pF, RL = 2 kΩ Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005- 0100)". Rev.2.00, Feb.18.2005, page 3 of 5 HD74LS08 Package Dimensions JEITA Package Code P-DIP14-6.3x19.2-2.54 RENESAS Code PRDP0014AB-B D 14 Previous Code DP-14AV 8 MASS[Typ.] 0.97g A1 LA E 1 Z 7 b3 e bp JEITA Package Code P-SOP14-5.5x10.06-1.27 RENESAS Code PRSP0014DF-B Previous Code FP-14DAV *1 D 14 8 *2 E HE Index mark 1 Z e 7 *3 b p xM A y θ MASS[Typ.] 0.23g F c e1 ( Ni/Pd/Au plating ) Reference Symbol e1 D E A A1 bp b3 c θ e Z L Dimension in Millimeters Min Nom Max 7.62 19.2 20.32 6.3 7.4 5.06 0.51 0.40 0.48 0.56 1.30 0.19 0.25 0.31 0° 15° 2.29 2.54 2.79 2.39 2.54 NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. A1 c bp Terminal cross section ( Ni/Pd/Au plating ) L1 Detail F L θ Reference Symbol D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 10.06 10.5 5.50 0.00 0.10 0.20 2.20 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 7.50 7.80 8.00 1.27 0.12 0.15 1.42 0.50 0.70 0.90 1.15 Rev.2.00, Feb.18.2005, page 4 of 5 HD74LS08 JEITA Package Code P-SOP14-3.95x8.65-1.27 RENESAS Code PRSP0014DE-A Previous Code FP-14DNV MASS[Typ.] 0.13g *1 D 14 8 NOTE) F 1. DIMENSIONS"*1 (Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. Index mark 1 Z e 7 *3 bp xM y A A1 *2 E HE c bp Terminal cross section ( Ni/Pd/Au plating ) L1 Detail F θ L Reference Symbol D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1 Dimension in Millimeters Min Nom Max 8.65 9.05 3.95 0.10 0.14 0.25 1.75 0.34 0.40 0.46 0.15 0.20 0.25 0° 8° 5.80 6.10 6.20 1.27 0.25 0.15 0.635 0.40 0.60 1.27 1.08 Rev.2.00, Feb.18.2005, page 5 of 5 Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap. Notes regarding these materials 1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party. 2..


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