Document
HD74LS08
Quadruple 2-Input Positive AND Gates
Features
• Ordering Information
Part Name
Package Type
Package Code (Previous Code)
Package Abbreviation
HD74LS08P
DILP-14 pin
PRDP0014AB-B (DP-14AV)
P
HD74LS08FPEL SOP-14 pin (JEITA)
PRSP0014DF-B (FP-14DAV)
FP
HD74LS08RPEL
SOP-14 pin (JEDEC)
PRSP0014DE-A (FP-14DNV)
RP
Note: Please consult the sales office for the above package availability.
REJ03D0394–0200 Rev.2.00
Feb.18.2005
Taping Abbreviation (Quantity) — EL (2,000 pcs/reel) EL (2,500 pcs/reel)
Pin Arrangement
1A 1 1B 2 1Y 3 2A 4 2B 5 2Y 6 GND 7
14 VCC 13 4B 12 4A 11 4Y 10 3B 9 3A 8 3Y
(Top view)
Rev.2.00, Feb.18.2005, page 1 of 5
HD74LS08
Circuit Schematic (1/4)
Inputs A B
VCC
20k
10k 8k
75
4.5k 1.5k 3k
Output Y
GND
Absolute Maximum Ratings
Item Supply voltage
Symbol VCC Note
Ratings 7
Input voltage
VIN 7
Power dissipation
PT 400
Storage temperature
Tstg –65 to +150
Note: Voltage value, unless otherwise noted, are with respect to network ground terminal.
Recommended Operating Conditions
Item Supply voltage
Output current
Operating temperature
Symbol VCC IOH IOL Topr
Min 4.75 — — –20
Typ 5.00 — — 25
Max 5.25 –400
8 75
Unit V V
mW °C
Unit V µA mA °C
Rev.2.00, Feb.18.2005, page 2 of 5
HD74LS08
Electrical Characteristics
Item Input voltage
Output voltage
Symbol VIH VIL VOH
VOL
Input current
IIH IIL
II
Short-circuit output current
IOS
Supply current
ICCH ICCL
Input clamp voltage
VIK
Note: * VCC = 5 V, Ta = 25°C
min. 2.0 — 2.7 — — — — —
–20
— — —
typ.* — — — — — — — —
—
2.4 4.4 —
max. — 0.8 — 0.5 0.4 20 –0.4 0.1
–100
4.8 8.8 –1.5
Unit V V V
V
µA mA mA
mA
mA mA V
(Ta = –20 to +75 °C)
Condition
VCC = 4.75 V, VIH = 2 V, IOH = –400 µA
IOL = 8 mA IOL = 4 mA
VCC = 4.75 V, VIL = 0.8 V
VCC = 5.25 V, VI = 2.7 V
VCC = 5.25 V, VI = 0.4 V
VCC = 5.25 V, VI = 7 V
VCC = 5.25 V
VCC = 5.25 V VCC = 5.25 V VCC = 4.75 V, IIN = –18 mA
Switching Characteristics
(VCC = 5 V, Ta = 25°C)
Item
Symbol
min.
typ.
max.
Unit
Condition
Propagation delay time
tPLH tPHL
— —
8 10
15 20
ns ns CL = 15 pF, RL = 2 kΩ
Note: Refer to Test Circuit and Waveform of the Common Item "TTL Common Matter (Document No.: REJ27D0005-
0100)".
Rev.2.00, Feb.18.2005, page 3 of 5
HD74LS08
Package Dimensions
JEITA Package Code P-DIP14-6.3x19.2-2.54
RENESAS Code PRDP0014AB-B
D 14
Previous Code DP-14AV
8
MASS[Typ.] 0.97g
A1 LA E
1 Z
7 b3
e bp
JEITA Package Code P-SOP14-5.5x10.06-1.27
RENESAS Code PRSP0014DF-B
Previous Code FP-14DAV
*1 D 14
8
*2 E HE
Index mark
1 Z
e
7 *3 b p
xM
A
y
θ
MASS[Typ.] 0.23g
F
c e1
( Ni/Pd/Au plating )
Reference Symbol
e1 D E A A1 bp b3 c θ e Z L
Dimension in Millimeters Min Nom Max
7.62 19.2 20.32 6.3 7.4
5.06 0.51 0.40 0.48 0.56
1.30 0.19 0.25 0.31
0° 15° 2.29 2.54 2.79
2.39 2.54
NOTE) 1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
A1 c
bp
Terminal cross section ( Ni/Pd/Au plating )
L1
Detail F
L
θ
Reference Symbol
D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1
Dimension in Millimeters Min Nom Max
10.06 10.5 5.50
0.00 0.10 0.20 2.20
0.34 0.40 0.46
0.15 0.20 0.25
0° 8° 7.50 7.80 8.00
1.27 0.12 0.15 1.42
0.50 0.70 0.90 1.15
Rev.2.00, Feb.18.2005, page 4 of 5
HD74LS08
JEITA Package Code P-SOP14-3.95x8.65-1.27
RENESAS Code PRSP0014DE-A
Previous Code FP-14DNV
MASS[Typ.] 0.13g
*1 D 14
8
NOTE) F 1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
Index mark
1 Z
e
7 *3 bp
xM
y
A A1
*2
E HE c
bp
Terminal cross section ( Ni/Pd/Au plating )
L1
Detail F
θ L
Reference Symbol
D E A2 A1 A bp b1 c c1 θ HE e x y Z L L1
Dimension in Millimeters Min Nom Max
8.65 9.05 3.95
0.10 0.14 0.25 1.75
0.34 0.40 0.46
0.15 0.20 0.25
0° 8° 5.80 6.10 6.20
1.27 0.25 0.15 0.635
0.40 0.60 1.27 1.08
Rev.2.00, Feb.18.2005, page 5 of 5
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Keep safety first in your circuit designs! 1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
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