Document
CYStech Electronics Corp.
General Purpose NPN Epitaxial Planar Transistor
Spec. No. : C618A3 Issued Date : 2009.07.07 Revised Date : Page No. : 1/3
LB120A3
Features
• Low collector saturation voltage • High breakdown voltage, VCEO=400V (min.) • Pb-free package
Symbol
LB120A3
Outline
TO-92
B:Base C:Collector E:Emitter
E CB
Absolute Maximum Ratings (Ta=25°C)
Parameter Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Power Dissipation Thermal Resistance, Junction to Ambient Junction Temperature Storage Temperature
Note : Pulse test, PW ≤ 10ms, Duty ≤ 50%.
Symbol VCBO VCEO VEBO IC PD RθJA
Tj Tstg
Limits 600 400 9 0.5 1 125 150 -55~+150
Unit V V V A W °C/W °C °C
LB120A3
CYStek Product Specification
http://www.Datasheet4U.com
CYStech Electronics Corp.
Characteristics (Ta=25°C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(SAT) *VCE(SAT) *hFE tf ts Min. 600 400 9 10 Typ. Max. 15 100 0.3 0.5 40 0.5 2.5 Unit V V V μA nA V V μs
Spec. No. : C618A3 Issued Date : 2009.07.07 Revised Date : Page No. : 2/3
Test Conditions IC=100μA IC=1mA IE=10μA VCB=600V, IE=0 VEB=8V, IC=0 IC=50mA, IB=10mA IC=200mA, IB=40mA VCE=20V, IC=20mA VCE=100V, IC=300mA, IB1=-IB2=100mA
*Pulse Test: Pulse Width ≤300μs, Duty Cycle≤2%
Classification Of hFE
Rank Range A 10~15 B 15~20 C 20~25 D 25~30 E 30~35 F 35~40
LB120A3
CYStek Product Specification
CYStech Electronics Corp.
TO-92 Dimension
α2
Marking:
Spec. No. : C618A3 Issued Date : 2009.07.07 Revised Date : Page No. : 3/3
A B
1 2 3
LB
α3
120A
C
D
H I E F
G
α1
Style: Pin 1.Emitter 2.Collector 3.Base 3-Lead TO-92 Plastic Package CYStek Package Code: A3
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I α1 α2 α3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2°
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2°
Notes: 1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
• Lead: KFC ; pure tin plated • Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. • CYStek reserves the right to make changes to its products without notice. • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
LB120A3
CYStek Product Specification
.