MMSZ5248B

Surface Mount Zener Diode              Features: Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited For Automated Assembly Processes Applications: Zener diode Ultra-small surface mount package Maximum Rating @ Ta = 25°C unless otherwise specified Characteristic Symbol Value Forward voltage Power dissipation @ IF=10mA VF PD 0.9 500 Thermal resistance, junction to ambient air RθjA 350 Junction temperature Tj 150 Storage temperature range Tstg -65 to +150 Note : Device mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms. Unit V mW °C/W °C °C Electrical Characteristics @ Ta = 25°C unless otherwise specified Type Number Type Code Zener Voltage Range Test Current Vz@IZT IZT Nom(V) Min(V) Max(V) mA Maximum Zener Impedance ZZT@IZT ZZK@IZK = 0.25mA Ω Maximum Reverse Leakage Current IR @VR μA V MMSZ5248B J3 18 17.1 18.9 7 21 600 0.1 14 www.element14.com www.farnell.com www.newark.com Page <1> 25/02/13 V1.0 http://www.Datasheet4U.com Surface Mount Zener Diode Typical Characteristics @ Ta = 25°C unless otherwise specified Package Outline Plastic surface mounted package www.element14.com www.farnell.com www.newark.com Page <2> 25/02/13 V1.0 Surface Mount Zener Diode Soldering Footprint Dimensions : Millimetres Package Information Device MMSZ5248B-7-F Package SOD-123 Shipping 3,000/Tape & Reel Part Number Table Description Surface Mount...