Surface Mount Zener Diode
Surface Mount
Zener Diode
Features:
• Planar Die Construction • 500mW Power Dissipation • General Pur...
Description
Surface Mount
Zener Diode
Features:
Planar Die Construction 500mW Power Dissipation General Purpose, Medium Current Ideally Suited For Automated Assembly Processes
Applications:
Zener diode Ultra-small surface mount package
Maximum Rating @ Ta = 25°C unless otherwise specified
Characteristic
Symbol
Value
Forward voltage Power dissipation
@ IF=10mA
VF PD
0.9 500
Thermal resistance, junction to ambient air
RθjA
350
Junction temperature
Tj 150
Storage temperature range
Tstg -65 to +150
Note : Device mounted on ceramic PCB; 7.6mm × 9.4mm × 0.87mm with pad areas 25mm2. Tested with pulses, Tp ≤ 1ms.
Unit V
mW °C/W
°C °C
Electrical Characteristics @ Ta = 25°C unless otherwise specified
Type Number
Type Code
Zener Voltage Range
Test Current
Vz@IZT
IZT
Nom(V) Min(V) Max(V) mA
Maximum Zener Impedance
ZZT@IZT ZZK@IZK = 0.25mA
Ω
Maximum Reverse Leakage Current
IR @VR
μA V
MMSZ5248B J3
18 17.1 18.9
7
21
600
0.1 14
www.element14.com www.farnell.com www.newark.com
Page <1>
25/02/13 V1.0
http://www.Datasheet4U.com
Surface Mount
Zener Diode
Typical Characteristics @ Ta = 25°C unless otherwise specified
Package Outline
Plastic surface mounted package
www.element14.com www.farnell.com www.newark.com
Page <2>
25/02/13 V1.0
Surface Mount
Zener Diode
Soldering Footprint
Dimensions : Millimetres
Package Information
Device MMSZ5248B-7-F
Package SOD-123
Shipping 3,000/Tape & Reel
Part Number Table
Description Surface Mount...
Similar Datasheet