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MT4C1M16C3 Dataheets PDF



Part Number MT4C1M16C3
Manufacturers Micron
Logo Micron
Description 1 MEG x 16 FPM DRAM
Datasheet MT4C1M16C3 DatasheetMT4C1M16C3 Datasheet (PDF)

1 MEG x 16 FPM DRAM FPM DRAM FEATURES • JEDEC- and industry-standard x16 timing, functions, pinouts, and packages • High-performance, low-power CMOS silicon-gate process • Single power supply (+3.3V ±0.3V or 5V ±0.5V) • All inputs, outputs and clocks are TTL-compatible • Refresh modes: RAS#-ONLY, CAS#-BEFORE-RAS# (CBR) and HIDDEN • Optional self refresh (S) for low-power data retention • BYTE WRITE and BYTE READ access cycles • 1,024-cycle refresh (10 row, 10 column addresses) • FAST-PAGE-MODE .

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1 MEG x 16 FPM DRAM FPM DRAM FEATURES • JEDEC- and industry-standard x16 timing, functions, pinouts, and packages • High-performance, low-power CMOS silicon-gate process • Single power supply (+3.3V ±0.3V or 5V ±0.5V) • All inputs, outputs and clocks are TTL-compatible • Refresh modes: RAS#-ONLY, CAS#-BEFORE-RAS# (CBR) and HIDDEN • Optional self refresh (S) for low-power data retention • BYTE WRITE and BYTE READ access cycles • 1,024-cycle refresh (10 row, 10 column addresses) • FAST-PAGE-MODE (FPM) access MT4C1M16C3, MT4LC1M16C3 For the latest data sheet revisions, please refer to the Micron Web site: www.micron.com/datasheets PIN ASSIGNMENT (Top View) 42-Pin SOJ VCC DQ0 DQ1 DQ2 DQ3 VCC DQ4 DQ5 DQ6 DQ7 NC NC WE# RAS# NC NC A0 A1 A2 A3 VCC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 VSS DQ15 DQ14 DQ13 DQ12 VSS DQ11 DQ10 DQ9 DQ8 NC CASL# CASH# OE# A9 A8 A7 A6 A5 A4 VSS VCC DQ0 DQ1 DQ2 DQ3 VCC DQ4 DQ5 DQ6 DQ7 NC 44/50-Pin TSOP 1 2 3 4 5 6 7 8 9 10 11 50 49 48 47 46 45 44 43 42 41 40 VSS DQ15 DQ14 DQ13 DQ12 VSS DQ11 DQ10 DQ9 DQ8 NC OPTIONS • Voltage 1 3.3V 5V • Packages Plastic SOJ (400 mil) Plastic TSOP (400 mil) • Timing 50ns access 60ns access • Refresh Rates Standard Refresh (16ms period) Self Refresh (128ms period) • Operating Temperature Range Commercial (0oC to +70oC) Extended (-20oC to +80oC) Part Number Example: MARKING LC C NC NC WE# RAS# NC NC A0 A1 A2 A3 VCC 15 16 17 18 19 20 21 22 23 24 25 36 35 34 33 32 31 30 29 28 27 26 NC CASL# CASH# OE# A9 A8 A7 A6 A5 A4 VSS DJ TG -5 -6 None S2 None ET 3 NOTE: The # symbol indicates signal is active LOW. 1 MEG x 16 FPM DRAM PART NUMBERS PART NUMBER MT4LC1M16C3DJ-6 MT4LC1M16C3DJ-6 S MT4LC1M16C3TG-6 MT4LC1M16C3TG-6 S MT4C1M16C3DJ-6 MT4C1M16C3TG-6 SUPPLY PACKAGE REFRESH 3.3V SOJ Standard 3.3V SOJ Self 3.3V TSOP Standard 3.3V TSOP Self 5V SOJ Standard 5V TSOP Standard MT4LC1M16C3DJ-5 NOTE: 1. The third field distinguishes the low voltage offering: LC designates VCC = 3.3V and C designates VCC = 5V. 2. Contact factory for availability. 3. Available only on MT4C1M16C3 (5V) GENERAL DESCRIPTION The 1 Meg x 16 DRAM is a randomly accessed, solidstate memory containing 16,777,216 bits organized in a x16 configuration. The 1 Meg x 16 DRAM has both BYTE WRITE and WORD WRITE access cycles via two CAS# pins (CASL# and CASH#). These function identically to a single CAS# on other DRAMs in that either CASL# or CASH# will generate an internal CAS#. The CAS# function and timing are determined by the first CAS# (CASL# or CASH#) to transition LOW and KEY TIMING PARAMETERS SPEED -5 -6 tRC tRAC tPC tAA tCAC tRP 84ns 110ns 50ns 60ns 20ns 35ns 25ns 30ns 15ns 15ns 30ns 40ns 1 Meg x 16 FPM DRAM D51_5V_B.p65 – Rev. B; Pub 3/01 1 Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2001, Micron Technology, Inc. Free Datasheet http://www.nDatasheet.com 1 MEG x 16 FPM DRAM GENERAL DESCRIPTION (continued) the last CAS# to transition back HIGH. Use of only one of the two results in a BYTE access cycle. CASL# transitioning LOW selects an access cycle for the lower byte (DQ0-DQ7), and CASH# transitioning LOW selects an access cycle for the upper byte (DQ8-DQ15). Each bit is uniquely addressed through the 20 address bits during READ or WRITE cycles. These are entered ten bits (A0-A9) at a time. RAS# is used to latch the first ten bits and CAS# the latter ten bits. The CAS# function is determined by the first CAS# (CASL# or CASH#) to transition LOW and the last one to transition back HIGH. The CAS# function also determines whether the cycle will be a refresh cycle (RAS#-ONLY) or an active cycle (READ, WRITE, or READ-WRITE) once RAS# goes LOW. The CASL# and CASH# inputs internally generate a CAS# signal that functions identically to a single CAS# input on other DRAMs. The key difference is that each CAS# input (CASL# and CASH#) controls its corresponding DQ tristate logic (in conjunction with OE# and WE#). CASL# controls DQ0-DQ7 and CASH# controls DQ8-DQ15. The two CAS# controls give the 1 Meg x 16 DRAM BYTE WRITE cycle capabilities. A logic HIGH on WE# dictates read mode, while a logic LOW on WE# dictates write mode. During a WRITE cycle, data-in (D) is latched by the falling edge of WE# or CAS, whichever occurs last. Taking WE# LOW will initiate a WRITE cycle, selecting DQ0-DQ15. If WE# goes LOW prior to CAS# going LOW, the output pin(s) remain open (High-Z) until the next CAS# cycle. If WE# goes LOW after CAS# goes LOW and data reaches the output pins, data-out (Q) is activated and retains the selected cell data as long as CAS# and OE# remain LOW (regardless of WE# or RAS#). This late WE# pulse results in a READ-WRITE cycle. The 16 data inputs and 16 data outputs are routed through 16 pins using common I/O. Pin direction is controlled by OE# and WE#. FUNCTIONAL BLOCK DIAGRAM WE# CASL# CASH# DQ0 16 NO. 2 CLOCK GENERATOR DATA-OUT BUFFER 10 CAS# DATA-I.


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