Ultra fast recovery type
Chip Silicon Rectifier
HFM101 THRU HFM107
Ultra fast recovery type
Formosa MS
SMA
0.185(4.8) 0.177(4.4) 0.012(0.3) Typ...
Description
Chip Silicon Rectifier
HFM101 THRU HFM107
Ultra fast recovery type
Formosa MS
SMA
0.185(4.8) 0.177(4.4) 0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy M olding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current.
0.067(1.7) 0.060(1.5)
0.110(2.8) 0.094(2.4)
0.165(4.2) 0.150(3.8)
0.040(1.0) Typ.
0.040 (1.0) Typ.
Mechanical data
Case : Molded plastic, JEDE C DO-214AC Terminals : Solder plated, s olderable per MIL-STD-750, Method 2026 Polarity : Indicated by cathode band Mounting P osition : Any Weight : 0.0015 ounce, 0.05 gram
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)
PARAMETER Forward rectified current Forward surge current CONDITIONS Ambient temperature = 50 C 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) VR = VRRM TA = 25o C
o
Symbol IO IFSM
MIN.
TYP.
MAX. 1.0 30 5.0 150
UNIT A A uA uA
o
Reverse current Thermal resistance Diode junction capacitance Storage temperature
VR = VRRM TA = 100o C Junction to ambient f=1MHz and applied 4vDC reverse voltage
IR Rq JA CJ TSTG -55 32 20
C / w pF
+150
o
C
SYMBOLS
MARKING CODE H11 H12 H13 H14 H15 H16 H17
V RRM
50
*1
V RMS
35 70
*2
VR
*3
VF
*4
T RR
*5
Operating temperature (o C)
(V) HFM101 HFM102 HFM103 HFM104 HFM105 HFM106 HFM107
(V)
(V) 50 100 200 300
(V)
(nS)
100 200 300 400 ...
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