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ADMP504 Dataheets PDF



Part Number ADMP504
Manufacturers Analog Devices
Logo Analog Devices
Description Ultralow Noise Microphone
Datasheet ADMP504 DatasheetADMP504 Datasheet (PDF)

Data Sheet Ultralow Noise Microphone with Bottom Port and Analog Output ADMP504 FEATURES FUNCTIONAL BLOCK DIAGRAM Tiny, 3.35 mm × 2.50 mm × 0.88 mm surface-mount package Omnidirectional response Very high SNR of 65 dBA Sensitivity of −38 dBV OUTPUT AMPLIFIER OUTPUT Extended frequency response from 100 Hz to 20 kHz Low current consumption: 180 µA Single-ended analog output 120 dB maximum SPL High PSR of 70 dBV Compatible with Sn/Pb and Pb-free solder processes E RoHS/WEEE compliant APPL.

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Data Sheet Ultralow Noise Microphone with Bottom Port and Analog Output ADMP504 FEATURES FUNCTIONAL BLOCK DIAGRAM Tiny, 3.35 mm × 2.50 mm × 0.88 mm surface-mount package Omnidirectional response Very high SNR of 65 dBA Sensitivity of −38 dBV OUTPUT AMPLIFIER OUTPUT Extended frequency response from 100 Hz to 20 kHz Low current consumption: 180 µA Single-ended analog output 120 dB maximum SPL High PSR of 70 dBV Compatible with Sn/Pb and Pb-free solder processes E RoHS/WEEE compliant APPLICATIONS T Smartphones and feature phones Tablet computers Teleconferencing systems Digital still and video cameras E Bluetooth headsets Notebook PCs Security and surveillance L GENERAL DESCRIPTION The ADMP5041 is a high performance, very low noise, low power, analog output, bottom-ported omnidirectional MEMS O microphone. The ADMP504 consists of a MEMS microphone element, an impedance converter and an output amplifier. The ADMP504 sensitivity specification makes it an excellent choice S for both near field and far field applications. The ADMP504 is function- and pin-compatible with the ADMP404 microphone, providing an easy upgrade path. The ADMP504 has very high SNR and extended wideband OB frequency response, resulting in natural sound with high 10140-001 ADMP504 POWER VDD GND Figure 1. 10140-011 Figure 2. Isometric Views of ADMP504 Microphone Package intelligibility. Low current consumption enables long battery life for portable applications. The ADMP504 complies with the TIA-920 Telecommunications Telephone Terminal Equipment Transmission Requirements for Wideband Digital Wireline Telephones standard. The ADMP504 is available in an ultraminiature 3.35 mm × 2.5 mm × 0.88 mm surface-mount package. It is reflow solder compatible with no sensitivity degradation. The ADMP504 is halide free. 1 Protected by U.S. Patents 7,449,356; 7,825,484; 7,885,423; 7,961,897. Other patents are pending. Rev. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011–2012 Analog Devices, Inc. All rights reserved. ADMP504 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Supporting Documents ................................................................7 Applications....................................................................................... 1 Handling Instructions.......................................................................8 Functional Block Diagram .............................................................. 1 Pick-and-Place Equipment ..........................................................8 General Description ......................................................................... 1 Reflow Solder .................................................................................8 Revision History ............................................................................... 2 Board Wash ....................................................................................8 Specifications..................................................................................... 3 PCB Land Pattern Layout.................................................................9 Absolute Maximum Ratings............................................................ 4 Reliability Specifications................................................................ 10 ESD Caution.................................................................................. 4 Pin Configuration and Function Descriptions............................. 5 Typical Performance Characteristics ............................................. 6 Applications Information ................................................................ 7 E REVISION HISTORY T 6/12—Rev. 0 to Rev. A Changes to Figure 2 .......................................................................... 1 Changes to General Description Section ...................................... 1 Change to Power Supply Rejection Parameter, Table 1 ............... 3 E Changes to Supporting Documents Section ................................. 7 Changes to Reflow Solder Section.................................................. 8 OBSOL 10/11—Revision 0: Initial Version Outline Dimensions ....................................................................... 11 Ordering Guide ..........................................................................


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