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MMZ0603S241C Dataheets PDF



Part Number MMZ0603S241C
Manufacturers TDK
Logo TDK
Description Chip Beads
Datasheet MMZ0603S241C DatasheetMMZ0603S241C Datasheet (PDF)

(1/3) Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type FEATURES • This is a multilayered chip bead product with dimensions of L0.6× W0.3× T0.3mm. • The product is magnetically shielded, allowing high density mounting. • We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz rang.

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(1/3) Chip Beads(SMD) For Signal Line MMZ Series MMZ0603 Type FEATURES • This is a multilayered chip bead product with dimensions of L0.6× W0.3× T0.3mm. • The product is magnetically shielded, allowing high density mounting. • We refined the rules for internal conductor design to reduce floating capacity between conductors, which in turn has contributed to a dramatic improvement in high frequency characteristics. We have also been able to expand and reinforce the EMI suppression in the GHz range. • It is a product conforming to RoHS directive. APPLICATIONS The removal of EMI components from signal lines in various modules, cellular phones and other sets that use very small components. PRODUCT IDENTIFICATION MMZ 0603 S 121 C T (1) (2) (3) (4) (5) (6) (1) Series name (2) Dimensions L× W (3) Material code (4) Nominal impedance 121:120Ω at 100MHz (5) Characteristic type (6) Packaging style T:Taping HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • Do not expose the inductors to stray magnetic fields. • Avoid static electricity discharge during handling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. Conformity to RoHS Directive MATERIAL CHARACTERISTICS S material: Standard type that features impedance characteristics similar to those of a typical ferrite core. For signal line applications in which the blocking region is near 100MHz. Impedance values selected for effectiveness at 40 to 300MHz. Y material: High frequency range type intended for the 100MHz region and above. For signal line applications in which the signal frequency is far from the cutoff frequency. Impedance values selected for effectiveness at 80 to 400MHz. D material: For applications calling for low insertion loss at low frequencies and sharply increasing impedance at high frequencies. Designed for high impedance at high frequencies (300MHz to 1GHz) for signal line applications. F material: This new product inherits the characteristic of our Dmaterial, namely its sharp impedance rise time, and its impedance peak frequency has been shifted higher into range. The product offers excellent noise suppression from 600MHz to as high as in the GHz range. TYPICAL MATERIAL CHARACTERISTICS http://www.DataSheet4U.net/ 2000 1800 1600 1400 1200 1000 800 600 400 200 0 10 100 Frequency(MHz) 1000 S F Y D • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 008-01 / 20080409 / e9412_mmz0603.fm datasheet pdf - http://www.DataSheet4U.net/ Impedance(Ω) (2/3) SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD PATTERN 0.6±0.03 0.3±0.03 0.30 ELECTRICAL CHARACTERISTICS Part No. MMZ0603S100C MMZ0603S800C MMZ0603S121C MMZ0603S241C MMZ0603S471C MMZ0603S601C MMZ0603Y121C MMZ0603Y241C MMZ0603Y471C MMZ0603D330C MMZ0603D560C MMZ0603D800C MMZ0603F100C ∗ 0.25 0.30 0.25 Weight: 0.3mg Dimensions in mm TEMPERATURE RANGES Operating/storage –55 to +125°C Impedance (Ω)[100MHz]∗ 10±5Ω 80±25% 120±25% 240±25% 470±25% 600±25% 120±25% 240±25% 470±25% 33±25% 56±25% 80±25% 10±5Ω DC resistance (Ω)max. 0.15 0.4 0.55 0.8 1.5 1.5 0.8 1.0 1.8 1.0 1.3 1.5 0.8 Rated current (mA)max. 500 200 200 200 100 100 200 100 50 100 100 100 200 0.3±0.03 PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 15000 pieces/reel Test equipment: E4991A or equivalent Test tool: 16197 or equivalent Test temperature: 25±10°C RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C 230˚C Natural cooling 180˚C 150˚C Preheating 60 to 120s Time(s) Soldering 30 to 60s http://www.DataSheet4U.net/ TYPICAL ELECTRICAL CHARACTERISTICS Z, X, R vs. FREQUENCY CHARACTERISTICS MMZ0603S100C MMZ0603S800C 50 45 40 35 30 25 20 15 10 5 0 450 400 350 Impedance(Ω) MMZ0603S121C 450 400 350 Impedance(Ω) Impedance(Ω) 300 250 200 150 100 50 0 Z R X 300 250 200 150 100 50 0 Z R X Z R X 1 10 100 1000 Frequency (MHz) 10000 1 10 100 1000 Frequency (MHz) 10000 1 10 100 1000 Frequency (MHz) 10000 MMZ0603S241C 450 400 350 Impedance(Ω) MMZ0603S471C 1000 800 Impedance(Ω) MMZ0603S601C 1000 800 Impedance(Ω) 300 250 200 150 100 50 0 1 10 100 1000 Frequency (MHz) 10000 X Z R 600 400 200 0 .


MMZ0603S121C MMZ0603S241C MMZ0603S471C


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