Document
NCP3337
Ultra High Accuracy, Low
Iq, 500 mA with Power
Good Low Dropout
Regulator
The NCP3337 is a high performance, low dropout regulator. With accuracy of ±0.9% over line and load and ultra−low quiescent current and noise it encompasses all of the necessary features required by today’s consumer electronics. This unique device is guaranteed to be stable without a minimum load current requirement and stable with any type of capacitor as small as 1.0 mF. The NCP3337 also comes equipped with sense and noise reduction pins to increase the overall utility of the device. The NCP3337 offers reverse bias protection.
Features
• High Accuracy Over Line and Load (±0.9% at 25°C) • Ultra−Low Dropout Voltage at Full Load (260 mV typ) • No Minimum Output Current Required for Stability • Low Noise (33 mVrms w/10 nF Cnr and 52 mVrms w/out Cnr) • Low Shutdown Current (< 1 mA) • Reverse Bias Protected • 2.9 V to 12 V Supply Range • Thermal Shutdown Protection • Current Limitation • Requires Only 1.0 mF Output Capacitance for Stability • Stable with Any Type of Capacitor (including MLCC) • Available in 1.8 V, 2.5 V, 3.3 V, 5.0 V and Adjustable Output
Voltages
• Power Good Output • These are Pb−Free Devices
Applications
• PCMCIA Card • Cellular Phones • Camcorders and Cameras • Networking Systems, DSL/Cable Modems • Cable Set−Top Box • MP3/CD Players • DSP Supply • Displays and Monitors
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DFN10 MN SUFFIX CASE 485C
MARKING DIAGRAM
1 P3337 xxx
ALYWG
G
Pin 1, 2. Vout 3. Sense / ADJ 4. GND 5. PWRG 6. NC 7. NR 8. SD
9, 10. Vin EP, GND
xxx = Specific Device Marking A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the package dimensions section on page 15 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
September, 2011 − Rev. 1
1
Publication Order Number: NCP3337/D
NCP3337
ON OFF
Vin Cin
1.0 mF
+
Cnr 6 7 (Optional)
8 NC SD
9 IN 10
IN
NR SENSE
OUT
OUT
R1 PWRG EP GND 100k 5 EP 4
3
2
1 Cout
1.0 mF
+
Vout
PWRG Figure 1. Typical Fixed Version Application Schematic
ON OFF
Vin +
Cin 1.0 mF
6 8 NC
SD
9 IN 10
IN
Cnr 7 (Optional) NR 3
ADJ OUT 2
1 OUT
R1 PWRG EP GND 100k 5 EP 4
Cout 1.0 mF
R2 R3 +
Vout
PWRG Figure 2. Typical Adjustable Version Application Schematic
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NCP3337
Vin SD NR
GND
Enable Block
Voltage Reference
NCP3337 Adjustable
Comp.
Current and Thermal Protection Circuit
Error Amplifier
Series Pass Element with Reverse Bias
Protection
Figure 3. Block Diagram, Adjustable Output Version
Vin SD NR
GND
Comp.
Enable Block
Voltage Reference
NCP3337 Fix
Current and Thermal Protection Circuit
Error Amplifier
Series Pass Element with Reverse Bias
Protection
Figure 4. Block Diagram, Fixed Output Version
PWRG Vout ADJ
PWRG Vout SENSE
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NCP3337
PIN FUNCTION DESCRIPTION
Pin No.
Pin Name
Description
1, 2 Vout Regulated output voltage. Bypass to ground with Cout w 1.0 mF 3 SENSE/ADJ For output voltage sensing, connect to Pins 1 and 2.at Fixed output Voltage version Adjustable pin at Adjustable output version
4
GND
Power Supply Ground
5
PWRG
Power Good
6 NC Not Connected
7 NR Noise Reduction Pin. This is an optional pin used to further reduce noise.
8 SD Shutdown pin. When not in use, this pin should be connected to the input pin.
9, 10 EPAD
Vin EPAD
Power Supply Input Voltage Exposed thermal pad should be connected to ground.
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage
Vin −0.3 to +16
V
Output Voltage
Vout −0.3 to Vin +0.3 or 10 V*
V
PWRG Pin Voltage
VPWRG
−0.3 to +16
V
Shutdown Pin Voltage
Vsh −0.3 to +16
V
Junction Temperature Range
TJ −40 to +150 °C
Storage Temperature Range
Tstg −50 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: This device series contains ESD protection and exceeds the following tests:
Human Body Model (HBM) JESD 22−A114−B Machine Model (MM) JESD 22−A115−A *Which ever is less. Reverse bias protection feature valid only if (Vout − Vin) ≤ 7 V.
THERMAL CHARACTERISTICS
Test Conditions (Typical Value)
Characteristic
Min Pad Board (Note 1)
1, Pad Board (Note 1)
Unit
Junction−to−Air, qJA
215 66 °C/W
Junction−to−Pin, J−L4
58 18 °C/W
1. As mounted on a 35 x 35 x 1.5 mm FR4 Substrate, with a single layer of a specified copper area of 2 oz (0.07 mm thick) copper traces and heat spreading area. JEDEC 51 specifications for a low and high conductivity test board recommend a 2 oz copper thickness. Test conditions are under natural convection or zero air flow.
.