SOT23

SUGGESTED PAD LAYOUT Based on IPC-7351A X1-DFN1006-2 / X2-DFN1006-2 / MiniMELF / MELF / SOD323 / SOD123 / SOD523 / SMA / SMB / SMC C X Y G Z Dimensions Z G X Y C X1-DFN1006-2 / MiniMELF X2-DFN1006-2 1.1 4.7 0.3 2.1 0.7 1.7 0.4 1.3 0.7 3.5 MELF 6.3 3.3 2.7 1.5 4.8 SOD123 4.9 2.5 0.7 1.2 3.7 SOD323 3.75 1.05 0.65 1.35 2.40 SOD523 2.3 1.1 0.8 0.6 1.7 SMA 6.5 1.5 1.7 2.5 4.0 SMB 6.8 1.8 2.3 2.5 4.3 SMC 9.4 4.4 3.3 2.5 6.8 X3-DFN0603-2 Z C www.DataSheet.net/ X1-DFN1006-3 / X2-DFN1006-3 C X1 X G2 Y (2x) Dimensions Value (in mm) C 0.355 X 0.230 Y 0.300 Z 0.610 G1 Y X (2x) Dimensions Value (in mm) Z 1.1 G1 0.3 G2 0.2 X 0.7 X1 0.25 Y 0.4 C 0.7 Z X1-DFN1212-3 X Y Y2 Y1 (2x) C X1 (2x) Dimensions C X X1 Y Y1 Y2 Value (in mm) 0.80 0.42 0.32 0.50 0.50 1.50 ALL DIMENSIONS ARE NOMINAL VALUES SHOWN IN MILLIMETERS Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These numbers may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering and is calculated by adding 0.2 mm to the ‘Z’ dimension. For further information, please reference document IPC-7351A, Naming Convention for Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97. AP02001 Rev. 43 1 of 14 www.diodes.com Suggested Pad Layout © Diodes Incorporated Datasheet pdf - http://www.DataSheet4U.co.kr/ X1-DFN...