SOT23

Package information - SOT23 Surface mounted, 3 pin package Package outline E e b 3 leads e1 L1 E1 D A A1 L c w w w . D a t a S h e e t . n e t / Dim. A A1 b c D e Millimeters Min. 0.01 0.30 0.085 2.80 Max. 1.12 0.10 0.50 0.20 3.04 - Inches Min. 0.0004 0.012 0.003 0.110 Max. 0.044 0.004 0.020 0.008 0.120 Dim. e1 E E1 L L1 - Millimeters Min. 2.10 1.20 0.25 0.45 Max. 2.64 1.40 0.60 0.62 1.90 NOM Inches Min. 0.083 0.047 0.0098 0.018 Max. 0.104 0.055 0.0236 0.024 0.075 NOM 0.95 NOM 0.037 NOM Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Soldering footprint 0.95 0.037 2.0 0.079 0.9 0.035 0.8 0.031 mm inches Issue 4 - May 2007 © Zetex Semiconductors plc 2007 1 www.zetex.com D a t a s h e e Package information - SOT23 Nominal weight Nominal weight per device 8mg. Tape and reel information Orientation Tape width (mm) 8 8 Reel size (inches) 7 13 No. of components 3,000 10,000 Tape option indicator TA TC Embossed carrier tape configuration P0 K t Top cover tape 10 pitches culmulative tolerance on tape ±0.2mm (±0.008”) D P2 E See Note 1 A0 See Note 1 F W B1 K0 See Note 1 B0 P Embossment Center lines of cavity D1 User direction of feed Dimensions mm (inches) A0, B0, K0 B1 (max.) D D1 (max.) E F P www.DataSheet.net/ Tape size (mm) 16 * 8 See note * 12 See note 8.20 (0.323) 1.50 + 0.10 - 0.00 1.50 (0.059) 1.75 ± 0.10 5.50 ± 0.05 (0.217 ± 0.002) 4.00 ±0.10 (0.157 ± 0.004) 8.00 ±0.10 (0.315 ± 0.004)...