Document
Micron Confidential and Proprietary
16, 32, 64, 128Gb NAND Flash Memory Features
NAND Flash Memory
MT29F16G08MAAWP, MT29F32G08QAAWP, MT29F64G08TAAWP, MT29F16G08MAAC3, MT29F32G08RAAC3, MT29F64G08UAAC4, MT29F32G08RAAC6, MT29F64G08UAAC6, MT29F128G08WAAC6
Features
• Open NAND Flash Interface (ONFI) 1.0 compliant • Multilevel cell (MLC) technology • Organization – Page size: x8: 4,314 bytes (4,096 + 218 bytes) – Block size:128 pages (512K + 27K bytes) – Plane size: 2,048 blocks – Device size: 16Gb: 4,096 blocks; 32Gb: 8,192 blocks; 64Gb: 16,384 blocks; 128Gb: 32,768 blocks • READ performance – Random READ: 50µs – Sequential READ: 25ns • WRITE performance – PROGRAM PAGE: 900µs (TYP) – BLOCK ERASE: 3.5ms (TYP) • Endurance – 10,000 PROGRAM/ERASE cycles (8-bit ECC1) • Data retention: 10 years • First block (block address 00h) guaranteed to be valid when shipped from factory1 • Industry-standard basic NAND Flash command set • Advanced command set – PROGRAM PAGE CACHE MODE – PAGE READ CACHE MODE – One-time programmable (OTP) commands – Two-plane commands – Interleaved die operations – READ UNIQUE ID (contact factory) • Operation status byte provides a software method of detecting: – Operation completion – Pass/fail condition – Write-protect status • Ready/busy# (R/B#) signal provides a hardware method of detecting PROGRAM or ERASE cycle completion • WP# signal: entire device hardware write protect • RESET required after power-up • INTERNAL DATA MOVE operations supported within the plane from which data is read
Figure 1:
48-Pin TSOP Type 1
Options
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• Density • Device width: x8 • Configuration: Package # of die # of CE# # of R/B# I/O TSOP/LGA 1 1 1 Common TSOP 2 2 2 Common TSOP 4 2 2 Common LGA 2 2 2 Separate LGA 4 2 2 Separate LGA 8 4 4 Separate • VCC: 2.7–3.6V • Package: 48 TSOP type I (lead-free plating) – 52-pad ULGA – 52-pad VLGA – 52-pad LLGA • Operating temperature: • Commercial temperature (0°C to 70°C) – Extended temperature (–40°C to +85°C)
Notes: 1. For details, see “Error Management” on page 88. 2. For part numbering and markings, see Figure 2 on page 2.
PDF: 09005aef8278ee3f / Source: 09005aef81f17540 16gb_nand_mlc_l52a__1.fm -Rev. D 5/08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.
Datasheet pdf - http://www.DataSheet4U.co.kr/
Micron Confidential and Proprietary
16, 32, 64, 128Gb NAND Flash Memory Part Numbering Information
Part Numbering Information
Micron NAND Flash devices are available in several different configurations and densities (see Figure 2). Figure 2: Part Number Chart
MT 29F 16G 08 Micron Technology Product Family
29F = Single-supply NAND Flash memory
M
A
A
WP
ES
:A Design Revision
A = First revision
Production Status
Blank = Production ES = Engineering sample MS = Mechanical sample QS = Qualification sample
Density
16G = 16Gb 32G = 32Gb 64G = 64Gb 128G = 128Gb
Operating Temperature Range
Blank = Commercial (0°C to +70°C) ET = Extended (–40°C to +85°C)
Device Width
08 = 8 bits
Reserved for Future Use Classification
# of die # of CE# # of R/B# I/O
Blank 1 2 2
2 2 4
M Q T R U W
1 2 4
2 4 8
1 2 2
2 2 4
Common Common Common
Separate Separate Separate
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NAND Flash Performance
Blank = Standard
Package Code
WP = 48-pin TSOP I (lead-free) C3 = 52-pad ULGA C4 = 52-pad VLGA C6 = 52-pad LLGA
Operating Voltage Range
A = 3.3V (2.7–3.6V)
Feature Set
A = Feature set A
Valid Part Number Combinations
After building the part number from the part numbering chart, verify that the part number is offered and valid by using the Micron Parametric Part Search Web site at www.micron.com/products/parametric. If the device required is not on this list, contact the factory.
PDF: 09005aef8278ee3f / Source: 09005aef81f17540 16gb_nand_mlc_l52a__1.fm -Rev. D 5/08 EN
2
Micron Technology, Inc., reserves the right to change products or specifications without notice. ©2005 Micron Technology, Inc. All rights reserved.
Datasheet pdf - http://www.DataSheet4U.co.kr/
Micron Confidential and Proprietary
16, 32, 64, 128Gb NAND Flash Memory Table of Contents Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Part Numbering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Valid Part Number Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .