Document
SiM3U1xx
High-Performance, Low-Power, 32-Bit Precision32™ USB MCU Family with up to 256 kB of Flash
32-bit ARM® Cortex™-M3 CPU
Analog Peripherals
- 80 MHz maximum frequency
- 2 x 12-Bit Analog-to-Digital Converters: Up to 250 ksps 12-bit
- Single-cycle multiplication, hardware division support
mode or 1 Msps 10-bit mode, internal or external reference
- Nested vectored interrupt control (NVIC) with 16 priority levels
Memory - 32–256 kB Flash, in-system programmable - 8–32 kB SRAM (including 4 kB retention SRAM) - 16-channel DMA controller - External bus interface supports up to 16 MB of external mem-
ory and a parallel LCD interface with QVGA resolution
Power Management - Low drop-out (LDO) regulator - Power-on reset circuit and brownout detectors
- 2 x 10-Bit Current-mode Digital-to-Analog Converters, four-
word buffer enables 12-bit operation
s - 2 x Low-current comparators
- 16-Channel Capacitance-to-Digital: Fast, <1 μA wake-on-touch
n - 2 x Current-to-Voltage Converter, up to 6 mA input range ig Digital and Communication Peripherals
- USB 2.0-compliant full speed with 10 endpoints, 2 kB buffer,
s oscillator with automatic frequency correction, and transceiver;
no external components needed
e - 2 x USARTs and 2 x UARTs with IrDA and ISO7816 SmartCard D - 3 x SPIs, 2 x I2C, I2S (receive and transmit), 16/32-bit CRC
- 5–3.3 V 150 mA regulator supports direct USB power - Adjustable external regulator supports up to 3.6 V, 1000 mA
w - Multiple power modes supported for low power optimization
Low Power Features
e - 85 nA current mode with voltage supply monitor enabled N - Low-current RTC: 350 nA internal LFO, 620 nA external crystal
- 12 μs wakeup (lowest power mode); 1.5 μs analog setting time
r - 275 μA/MHz active current
- Clocks can be gated off from unused peripherals to save power
fo - Flexible clock divider: Reduce operational frequency up to 128x
Clock Sources
d - Internal oscillator with PLL: 23-80 MHz, reduced EMI mode
- USB internal 48 MHz oscillator supports crystal-less operation
e - Low power internal oscillator: 20 MHz and 2.5 MHz modes d - Low frequency internal oscillator: 16.4 kHz
- External oscillators: Crystal, RC, C, CMOS and RTC Crystal
n Temperature Range: –40 to +85 °C e Package Options
- QFN options: 40-pin (6 x 6 mm), 64-pin (9 x 9 mm)
m - TQFP options: 64-pin (10 x 10 mm), 80-pin (12 x 12 mm) Not Recom - LGA option: 92-pin (7 x 7 mm)
- 128/192/256-bit Hardware AES Encryption
Timers/Counters - 2 x 32-bit or 4 x 16-bit timers with capture/compare - 2 x 16-bit, 2-channel counters with capture/compare/PWM - 16-bit, 6-channel counter with capture/compare/PWM and
dead-time controller with differential outputs
- 16-bit low power timer/pulse counter operational in sleep - 32-bit real time clock (RTC) with multiple alarms - Watchdog timer
Up to 65 Flexible I/O - Up to 59 contiguous GPIO with two priority crossbars providing
flexibility in pin assignments; 12 x 5 V tolerant GPIO
- Up to 6 programmable high drive capable (5–300 mA, 1.8–6 V)
I/O can drive LEDs, power MOSFETs, buzzers, etc.
On-Chip Debugging - Serial wire debug (SWD) or JTAG (no boundary scan), serial
wire viewer (SWV)
- Cortex-M3 embedded trace macrocell (ETM)
Supply Voltage - 2.7 to 5.5 V (regulator enabled) - 1.8 to 3.6 V (regulator disabled)
Rev. 1.1 1/21
Copyright © 2012 by Silicon Laboratories
SiM3U1xx
SiM3U1xx
Table of Contents
1. Related Documents and Conventions ...............................................................................4 1.1. Related Documents........................................................................................................4 1.1.1. SiM3U1xx/SiM3C1xx Reference Manual...............................................................4
s 1.1.2. Hardware Access Layer (HAL) API Description ....................................................4 n 1.1.3. ARM Cortex-M3 Reference Manual.......................................................................4
1.2. Conventions ...................................................................................................................4
ig 2. Typical Connection Diagrams ............................................................................................5 s 2.1. Power .............................................................................................................................5
3. Electrical Specifications......................................................................................................8
e 3.1. Electrical Characteristics ................................................................................................8 D 3.2. Thermal Conditions ......................................................................................................33
3.3. Absolute Maximum Ratings..........................................................................................33 4. Precision32™ SiM3U1xx System Overview ......................................................