DatasheetsPDF.com

MAX14579E Dataheets PDF



Part Number MAX14579E
Manufacturers Maxim Integrated Products
Logo Maxim Integrated Products
Description Low-Power Headset Detectors
Datasheet MAX14579E DatasheetMAX14579E Datasheet (PDF)

MAX14579E/MAX14579AE 19-5964; Rev 0; 06/11 EVAALVUAAILTAIOBNLEKIT Low-Power Headset Detectors with SEND/END Button Support General Description The MAX14579E/MAX14579AE provide a simple solution for detecting the insertion and managing the operation of a 3.5mm stereo headset with a microphone. These devices integrate all circuitry required to detect SEND/ END button press events and generate required microphone bias voltages. The devices are managed with only three GPIOs from the host controll.

  MAX14579E   MAX14579E


Document
MAX14579E/MAX14579AE 19-5964; Rev 0; 06/11 EVAALVUAAILTAIOBNLEKIT Low-Power Headset Detectors with SEND/END Button Support General Description The MAX14579E/MAX14579AE provide a simple solution for detecting the insertion and managing the operation of a 3.5mm stereo headset with a microphone. These devices integrate all circuitry required to detect SEND/ END button press events and generate required microphone bias voltages. The devices are managed with only three GPIOs from the host controller to select between call mode and standby mode, and monitor the SEND/END and jack insertion status. In call mode, the low-noise LDO is enabled to provide DC bias to the externally preamplified microphone. In standby mode, microphone low-power pulsing is enabled to reduce supply current while waiting for a SEND/END button press event. Two open-drain outputs signal the host controller when an insertion/removal or SEND/END button press event occurs. The MAX14579E/MAX14579AE manage jack insertion detection by monitoring a 3.5mm socket with a normally open jack insertion switch. The devices are available in an 8-pin TDFN package, and are fully specified over the -40NC to +85NC extended temperature range. Features S 3.5mm Jack Insertion Detection S Simple Interface: One Input/Two Open-Drain Outputs S Low-Power Microphone Mode S Low-Noise, High-PSRR Microphone Bias Generator S Click-and-Pop Suppression S High-ESD Protection on MIC and DETIN Inputs ±15kV Human Body Model (HBM) Cell Phones e-Readers Tablet PCs Applications Ordering Information PART TEMP RANGE PIN-PACKAGE MAX14579EETA+ -40NC to +85NC 8 TDFN-EP* MAX14579AEETA+** -40NC to +85NC 8 TDFN-EP* +Denotes a lead(Pb)-free/RoHS compliant package. *EP = Exposed pad. **Future product—contact factory for availablity. Typical Operating Circuit ADC 1µF 3.3V MODE VCC CAP 3.3V PROCESSOR 1MΩ MAX14579E SWD RES 3.3V 1MΩ DETIN DET EP/GND MIC 0.22µF 2.2kΩ AUDIO AMPLIFIER MICROPHONE AMPLIFIER 0.1µF 3.5mm SOCKET 10kΩ ________________________________________________________________ Maxim Integrated Products   1 For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. MAX14579E/MAX14579AE Low-Power Headset Detectors with SEND/END Button Support ABSOLUTE MAXIMUM RATINGS (Voltages referenced to ground.) VCC, MODE, SWD, DET...........................................-0.3V to +6V CAP, MIC, DETIN, RES............................. -0.3V to (VCC + 0.3V) Continuous Current into Any Terminal........................... Q100mA Continuous Power Dissipation (TA = +70NC) TDFN (derate 11.9mW/NC above +70NC)..................953.5mW Operating Temperature Range........................... -40NC to +85NC Junction Temperature......................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow).......................................+260NC Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PACKAGE THERMAL CHARACTERISTICS (Note 1) TDFN Junction-to-Ambient Thermal Resistance (BJA)........83.9NC/W Junction-to-Case Thermal Resistance (BJC)................37NC/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (VCC = 2.5V to 5.5V, CDETIN < 100pF, TA = -40NC to +85NC, unless otherwise noted. Typical values are at VCC = 3.6V, TA = +25NC.) (Note 2) PARAMETER DC CHARACTERISTICS Supply Voltage Range VCC Undervoltage-Lockout Threshold VCC Supply Current DETIN Pullup Resistance Internal Microphone Bias Voltage MIC SEND/END Detection Threshold SYMBOL VCC VCCUVLO ICC RDETIN VBIAS CONDITIONS VCC rising VCC = 2.8V MODE = low, DETIN = high MODE = low, DETIN = low, IMIC = 300FA MODE = high, DETIN = low, IMIC = 300FA MODE = low MODE = high, DETIN = low DETIN Detection Threshold Falling edge MIN 2.5 0.9 0.20 O VBIAS 1/3 O VCC TYP 1.7 0.8 8 500 1000 VCC 2.2 0.22 O VBIAS 1/2 O VCC MAX 5.5 2.45 1.3 11 800 0.24 O VBIAS 2/3 O VCC UNITS V V FA kI V V V 2   _______________________________________________________________________________________ MAX14579E/MAX14579AE Low-Power Headset Detectors with SEND/END Button Support ELECTRICAL CHARACTERISTICS (continued) (VCC = 2.5V to 5.5V, CDETIN < 100pF, TA = -40NC to +85NC, unless otherwise noted. Typical values are a.


MAX14578E MAX14579E MAX14579AE


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)