Flip Chip Protection Diode
www.DataSheet.co.kr
VISHAY
VESD05C-FC1
Vishay Semiconductors
Flip Chip Protection Diode - Chip Size 0402
Description...
Description
www.DataSheet.co.kr
VISHAY
VESD05C-FC1
Vishay Semiconductors
Flip Chip Protection Diode - Chip Size 0402
Description
Flip Chip is a chip with all packaging and interconnections manufactured on the wafer prior to dicing. The interconnections are made of solder bumps on i/o pads.Our device utilizes a silicon P/N junction for excellent clamping (protection) performance with low leakage current characteristic.
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19120
Features
ESD protection to IEC 61000-4-2 30 kV (air) ESD protection to IEC 61000-4-2 8 kV (contact) ESD protection to IEC 61000-4-5 (lightning): 8/20 µs, IPPM = 10 mA 120 W peak pulse power dissipation per line (8/20 µs) Suitable for high frequency applications (low capacitance, low parasitic inductance) Low clamping voltage Minimum PCB space needed (0.5 mm2), < 0.55 mm height, only 0.47 mg/pcs No need for underfill material and/or additional solder Can be assembled using standard SMT pick & place equipment, reflow processes per J-STD-020 and assembly methods Green product
Applications
Cellular phones Personal digital assistants (PDA), notebook computers MP3 players GPS Digital cameras Bluetooth Audio amplifiers DVD Power management systems Read write heads for hard drives Modules for watches CPU Digital TV’s and sattelites receivers SMART cards
Mechanical Data
Case: Flip Chip 1005 Standard EIA chip size: 0402 8 mm tape and reel per EIA-481-1-A/IEC60286 Top contacts: 4 solder bumps 100 µm in height (nominal) Bumps of SnAgCu (lead-free...
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