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K9K8G08U0D Dataheets PDF



Part Number K9K8G08U0D
Manufacturers Samsung
Logo Samsung
Description 4Gb D-die NAND Flash
Datasheet K9K8G08U0D DatasheetK9K8G08U0D Datasheet (PDF)

www.DataSheet4U.net Rev.0.2, May. 2010 K9F4G08U0D K9K8G08U0D K9K8G08U1D K9WAG08U1D Advance 4Gb D-die NAND Flash Single-Level-Cell (1bit/cell) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole.

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www.DataSheet4U.net Rev.0.2, May. 2010 K9F4G08U0D K9K8G08U0D K9K8G08U1D K9WAG08U1D Advance 4Gb D-die NAND Flash Single-Level-Cell (1bit/cell) datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property right is granted by one party to the other party under this document, by implication, estoppel or otherwise. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where product failure could result in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply. For updates or additional information about Samsung products, contact your nearest Samsung office. All brand names, trademarks and registered trademarks belong to their respective owners. ⓒ 2010 Samsung Electronics Co., Ltd. All rights reserved. -1- www.DataSheet4U.net K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D Revision History Revision No. 0.0 1. Initial issue 0.1 1. Corrected errata. 2. Chapter 1.2 Features revised. 0.2 1. DDP/QDP Part ID are added. datasheet History Advance Rev. 0.2 FLASH MEMORY Draft Date Jan. 12, 2010 May. 03, 2010 Remark Advance Advance Editor - H.K.Kim May. 26, 2010 Advance H.K.Kim The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the SAMSUNG branch office near your office. -2- www.DataSheet4U.net K9F4G08U0D K9K8G08U1D K9K8G08U0D K9WAG08U1D datasheet Advance Rev. 0.2 FLASH MEMORY Table Of Contents 1.0 INTRODUCTION ........................................................................................................................................................ 4 1.1 General Description................................................................................................................................................. 4 1.2 Features .................................................................................................................................................................. 4 1.3 PRODUCT LIST ...................................................................................................................................................... 4 1.4 Pin Configuration (TSOP1) ...................................................................................................................................... 5 1.4.1 PACKAGE DIMENSIONS ................................................................................................................................. 5 1.5 Pin Configuration (TSOP1) ...................................................................................................................................... 6 1.5.1 PACKAGE DIMENSIONS ................................................................................................................................. 6 1.6 Pin Description ........................................................................................................................................................ 7 2.0 PRODUCT INTRODUCTION...................................................................................................................................... 9 2.1 Absolute Maximum Ratings ..................................................................................................................................... 10 2.2 Recommended Operating Conditions ..................................................................................................................... 10 2.3 DC AND OPERATING CHARACTERISTICS(Recommended operating conditions otherwise noted.) ..................10 2.4 Valid Block............................................................................................................................................................... 11 2.5 Ac Test Condition .................................................................................................................................................... 11 2.6 Capacitance(TA=25°C, VCC=3.3V, f=1.0MHz) ....................................................................................................... 11 2.7 Mode Selection........................................................................................................................................................ 11 2.8 Program / Erase Characteristics .......................


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