MT9N011

MT9N011: 9Mp CMOS Digital Image Sensor Die Features www.DataSheet4U.com 1/2.3-Inch, 9Mp CMOS Active-Pixel Digital Image Sensor Die MT9N011 Die Data Sheet For the product data sheet, refer to Aptina’s Web site: www.aptina.com Features Die Database Die outline, see Figure 5 on page 14Figure 5 on page 14 Singulated die size: 8672µm ±25µm x 8369µm ±25µm Bond Pad Identification Tables, see pages 8–13 DigitalClarity® CMOS imaging technology Low dark current Simple two-wire serial interface Auto black-level calibration Support for external mechanical shutter Support for external LED or xenon flash High frame rate preview mode with arbitrary downsize scaling from maximum resolution Programmable controls: gain, horizontal and vertical blanking, auto black level offset correction, frame size/rate, exposure, left-right and top-bottom image reversal, window size, and panning Data interfaces: parallel or serial – CCP2-compliant, sub-low-voltage, differential signaling (sub-LVDS) – One- or two-lane mobile industry processor interface (MIPI) On-die phase-lock loop (PLL) oscillator Bayer pattern down-size scaler One-time programmable (OTP) memory for storing module information Superior low-light performance Integrated position-based color and lens shading correction Options Form – Die Testing – Standard (level 1) probe Designator D C1 Key Performance Parameters Optical format: 1/2.3-inch (4:3) Active imager size: 6.104mm(H) x 4.578mm(V), 7.6...