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IP4254CZ8 Dataheets PDF



Part Number IP4254CZ8
Manufacturers NXP Semiconductors
Logo NXP Semiconductors
Description (IP4255CZxx / IP4254CZxx) passive filter network
Datasheet IP4254CZ8 DatasheetIP4254CZ8 Datasheet (PDF)

DataSheet.in IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4 Rev. 02 — 8 November 2007 Product data sheet 1. Product profile 1.1 General description The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family consists of 4-, 6- and 8-channel RC low-pass filter arrays which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition, the IP.

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DataSheet.in IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive filter network with ESD protection to IEC 61000-4-2, level 4 Rev. 02 — 8 November 2007 Product data sheet 1. Product profile 1.1 General description The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family consists of 4-, 6- and 8-channel RC low-pass filter arrays which are designed to provide filtering of undesired RF signals on the I/O ports of portable communication or computing devices. In addition, the IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family incorporates diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages as high as ±30 kV. The IP4253CZ8/CZ12/CZ16; IP4254CZ8/CZ12/CZ16 family is fabricated using monolithic silicon technology and integrates up to 8 resistors and 16 diodes in a 0.4 mm pitch 8-, 12or 16-pin MicroPak (compatible with QFN) lead-free plastic package with a height of 0.5 mm only. 1.2 Features I Pb-free and dark green compliant I 4-, 6- and 8-channel integrated π-type RC filter network I IP4253CZ8/CZ12/CZ16: 200 Ω channel series resistance, 30 pF (at 2.5 V DC) channel capacitance I IP4254CZ8/CZ12/CZ16: 100 Ω channel series resistance, 30 pF (at 2.5 V DC) channel capacitance I ESD protection to ±30 kV contact discharge according to IEC 61000-4-2 standard far exceeding level 4 I MicroPak (QFN compatible) plastic package with 0.4 mm pitch 1.3 Applications I General purpose ElectroMagnetic Interference (EMI) and Radio-Frequency Interference (RFI) filtering and downstream ESD protection for: N Cellular and Personal Communication System (PCS) mobile handsets N Cordless telephones N Wireless data (WAN/LAN) systems N PDAs DataSheet.in NXP Semiconductors IP425xCZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive filter network 2. Pinning information Table 1. Pin CZ8 1 and 8 2 and 7 3 and 6 4 and 5 ground pad CZ12 1 and 12 2 and 11 3 and 10 4 and 9 5 and 8 6 and 7 ground pad CZ16 1 and 16 2 and 15 3 and 14 4 and 13 5 and 12 6 and 11 7 and 10 8 and 9 ground pad filter channel 1 filter channel 2 filter channel 3 filter channel 4 filter channel 5 filter channel 6 filter channel 7 filter channel 8 ground 1 Transparent top view 8 GND 001aaf980 Pinning IP4253CZx and IP4254CZx Description filter channel 1 filter channel 2 filter channel 3 filter channel 4 ground 1 4 Transparent top view 8 5 1, 2, 3, 4 Cch 2 Cch 2 Rs(ch) Simplified outline Symbol 5, 6, 7, 8 GND 001aaf978 filter channel 1 filter channel 2 filter channel 3 filter channel 4 filter channel 5 filter channel 6 ground 1 Transparent top view 6 GND 001aaf979 12 7 1, 2, 3, 4, 5, 6 Rs(ch) Cch 2 Cch 2 7, 8, 9, 10, 11, 12 16 9 1, 2, 3, 4, 5, 6, 7, 8 Rs(ch) Cch 2 Cch 2 9, 10, 11, 12, 13, 14, 15, 16 IP4253_54_CZ8_CZ12_CZ16_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 8 November 2007 2 of 10 DataSheet.in NXP Semiconductors IP425xCZ8/CZ12/CZ16 Integrated 4-, 6- and 8-channel passive filter network 3. Ordering information Table 2. Ordering information Package Name IP4253CZ8-4 HXSON8 Description plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.5 mm plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.5 mm plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.5 mm plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 × 1.7 × 0.5 mm plastic thermal enhanced extremely thin small outline package; no leads; 12 terminals; body 1.35 × 2.5 × 0.5 mm plastic thermal enhanced extremely thin small outline package; no leads; 16 terminals; body 1.35 × 3.3 × 0.5 mm Version SOT983-1 SOT984-1 SOT985-1 SOT983-1 SOT984-1 SOT985-1 Type number IP4253CZ12-6 HXSON12 IP4253CZ16-8 HXSON16 IP4254CZ8-4 HXSON8 IP4254CZ12-6 HXSON12 IP4254CZ16-8 HXSON16 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC Vesd Parameter supply voltage electrostatic discharge voltage all pins to ground contact discharge air discharge IEC 61000-4-2, Level 4; all pins to ground contact discharge air discharge Pch Ptot Tstg Tamb [1] [1] [1] Conditions Min −0.5 −30 −30 Max +5.6 +30 +30 Unit V kV kV −8 −15 −55 −40 +8 +15 60 200 +150 +85 kV kV mW mW °C °C channel power dissipation Tamb = 85 °C total power dissipation storage temperature ambient temperature Tamb = 85 °C Device withstands ≥ 1000 discharges with ±30 kV using the IEC 61000-4-2 model without degradation. 5. Thermal characteristics Table 4. Symbol Rth(j-pcb) [1] Thermal characteristics Parameter Conditions Typ 120[1] Unit K/W thermal resistance from junction to 2 layer printed-circuit printed-circuit board board Depends on layout details. IP4253_54_CZ8_CZ12_CZ16_2 © NXP B.V. 2007. All rights reserved. Product data sheet Rev. 02 — 8 November 2007 3 of 10 DataSheet.in NXP Semiconductors IP425xCZ8.


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