256M bits SDRAM
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DATA SHEET
256M bits SDRAM
EDS2532EESL-75 (8M words × 32 bits)
Specifications
• Density: 256M bits...
Description
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DATA SHEET
256M bits SDRAM
EDS2532EESL-75 (8M words × 32 bits)
Specifications
Density: 256M bits Organization 2M words × 32 bits × 4 banks Package: 92-ball FBGA Lead-free (RoHS compliant) Power supply: VDD, VDDQ = 1.8V ± 0.1V Clock frequency: 133MHz (max.) 2KB page size Row address: A0 to A11 Column address: A0 to A8 Four internal banks for concurrent operation Interface: LVCMOS Burst lengths (BL): 1, 2, 4, 8, full page Burst type (BT): Sequential (1, 2, 4, 8, full page) Interleave (1, 2, 4, 8) /CAS Latency (CL): 2, 3 Precharge: auto precharge operation for each burst access Driver strength: half/quarter Refresh: auto-refresh, self-refresh Refresh cycles: 4096 cycles/64ms Average refresh period: 15.6µs Operating ambient temperature range TA = 0°C to +70°C
Pin Configurations
/xxx indicates active low signal.
92-ball FBGA
1 2 3 4 5 6 7 8 9 10 11
A
NC VDD VSS VSS VDD NC
EO
Features
B
VSSQ DQ15 DQ0 VDDQ DQ1 DQ2 VSSQ DQ3 VDDQ DQ5 DQ4 DQ6
C
VDDQ DQ13 DQ14
D
DQ11 DQ12
E
DQ9 DQ10 VSSQ
F
DQ8 VDDQ VSSQ DQ7 VDD DQM0 /WE /CAS /RAS A9 A7 BA0 A10 A11 BA1 A1 VDD DQM2 NC NC A0 A2
G
CLK DQM1 VSS
×32 organization Single pulsed /RAS Burst read/write operation and burst read/single write operation capability Byte control by DQM
Document No. E0888E10 (Ver. 1.0) Date Published March 2006 (K) Japan Printed in Japan URL: http://www.elpida.com
L
H
CKE /CS NC A6 A4 DQM3 VSS
J
A8
K
NC
L
A5
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